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74AC11521DWR

Texas Instruments

74AC11521DWR by Texas Instruments

74AC11521DWR by Texas Instruments is an 8-bit digital arithmetic circuit with a nominal voltage of 5V and propagation delay of 11.4ns. It is used in industrial applications, operates b/w -40 to 85°C, and features inverted output polarity for versatile usage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,706 parts In-Stock

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Vyrian

USA . 3,114 parts In-Stock

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3,114

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Distributors (Availability)

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Native Components

USA . 846 parts In-Stock

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$0.312

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$0.300

846

$0.312

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$0.300

Northwest PG Solutions

USA . 416 parts In-Stock

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$0.343

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$0.303

416

$0.343

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$0.303

AZTECH Wire

Italy . 459 parts In-Stock

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$5.587

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459

$5.587

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Parana Technologies

USA . 1,272 parts In-Stock

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$14.165

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$14.624

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1,272

$14.165

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$14.624

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ChromeModa Solutions

Germany . 6,912 parts In-Stock

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$15.916

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$13.051

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6,912

$15.916

$13.051

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IDEA Electronic Components Group

UK . 1,592 parts In-Stock

1+ parts

$15.916

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$15.120

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$14.324

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1,592

$15.916

$15.120

$14.324

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One Stop Electronics

USA . 1,006 parts In-Stock

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$39.000

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1,006

$39.000

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Andel Nordic

Denmark . 254 parts In-Stock

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$48.655

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$46.709

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$46.709

254

$48.655

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$46.709

Corphita

USA . 1,906 parts In-Stock

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1,906

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DigiPath Technology Company

USA . 897 parts In-Stock

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$14.350

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897

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Overview

Upgrade your digital arithmetic circuits with the 74AC11521DWR by Texas Instruments, a top-tier manufacturer known for its high-quality products. This versatile component offers a myriad of applications in various industries, providing unmatched reliability and performance. With a nominal supply voltage of 5V and a propagation delay of just 11.4ns, this product ensures efficient operation while maintaining a compact package design. Trust Texas Instruments to deliver exceptional value and benefits with the 74AC11521DWR, setting you up for success in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the circuit, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and making assembly more efficient.

No. of Bits: 8

Offers a suitable level of precision for digital arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage ensures reliable performance of the circuit.

Propagation Delay (tpd): 11.4 ns

Fast propagation delay enables quick calculations and response times.

Maximum Operating Temperature: 85 °C

Can operate in higher temperature environments, suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for digital circuits.

Technical Specifications

Digital Arithmetic Circuits 74AC11521DWR attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

11.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

74AC11521DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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