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74AC11181N

Texas Instruments

74AC11181N by Texas Instruments

74AC11181N by Texas Instruments is a CMOS digital arithmetic circuit with 28 terminals, operating b/w -40 to 85°C. It has power supplies of 3.3/5V and a rectangular package shape made of plastic/epoxy. Ideal for industrial applications requiring precise calculations in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,788 parts In-Stock

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Digiode

USA . 1,000 parts In-Stock

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1,000

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AZTECH Wire

Italy . 222 parts In-Stock

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$12.132

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One Stop Electronics

USA . 604 parts In-Stock

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$23.000

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Parana Technologies

USA . 294 parts In-Stock

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$26.487

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$27.064

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DigiPath Technology Company

USA . 1,327 parts In-Stock

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$29.166

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$26.833

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ChromeModa Solutions

Germany . 3,653 parts In-Stock

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$29.761

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$24.404

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$29.761

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IDEA Electronic Components Group

UK . 1,305 parts In-Stock

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$29.761

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$28.273

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$26.785

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Northwest PG Solutions

USA . 878 parts In-Stock

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Corphita

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Native Components

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Overview

Looking to enhance your digital arithmetic circuits? Look no further than the 74AC11181N by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-quality products that meet and exceed industry standards. This versatile component is perfect for a wide range of applications, offering customers unmatched value, reliability, and performance. Upgrade your electronics with the 74AC11181N and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal circuitry of the product, making it suitable for industrial environments.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing electronic systems and PCB layouts, optimizing space usage.

Power Supplies (V): 3.3/5

Support for multiple power supplies (3.3V and 5V) offers flexibility in powering options, making it compatible with a wide range of applications.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with other components and peripherals in a system.

Package Style (Meter): IN-LINE

In-line package style facilitates easy installation and maintenance of the product within a larger system setup.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance even in harsh industrial environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature means the product can operate effectively even in cold environments, expanding its usability range.

Terminal Position: DUAL

Dual terminal position allows for redundancy and ensures stable connections for uninterrupted data flow.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification signifies that the product is designed to meet performance standards in demanding industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and stable connections, reducing the risk of loose connections and signal interference.

Terminal Pitch: 2.54 mm

Standard 2.54mm terminal pitch allows for easy soldering and integration into existing PCB layouts, simplifying installation processes.

Technical Specifications

Digital Arithmetic Circuits 74AC11181N attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

Logic IC Type:

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

74AC11181N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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