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74AC11280N

Texas Instruments

74AC11280N by Texas Instruments

74AC11280N by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 10.9 ns and operates at supply voltages of 3.3/5 V. It is commonly used in industrial applications requiring fast arithmetic calculations and precise signal processing due to its complementary output polarity and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,604 parts In-Stock

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Vyrian

USA . 2,528 parts In-Stock

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Electronic Expediters

USA . 500 parts In-Stock

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Northwest PG Solutions

USA . 2,051 parts In-Stock

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$2.661

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Andel Nordic

Denmark . 2,274 parts In-Stock

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$6.138

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$5.893

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AZTECH Wire

Italy . 897 parts In-Stock

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Parana Technologies

USA . 1,433 parts In-Stock

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$12.378

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DigiPath Technology Company

USA . 2,088 parts In-Stock

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$13.182

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ChromeModa Solutions

Germany . 4,405 parts In-Stock

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$13.451

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IDEA Electronic Components Group

UK . 2,015 parts In-Stock

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$12.106

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One Stop Electronics

USA . 1,047 parts In-Stock

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Corphita

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Native Components

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Overview

Unlock the power of digital arithmetic circuits with the Texas Instruments 74AC11280N. Manufactured by industry leader Texas Instruments, this high-quality product offers customers the perfect balance of performance and reliability. Ideal for a wide range of applications, this product provides exceptional value with its fast propagation delay, low power consumption, and versatile terminal form. Whether you're looking to upgrade your current system or embark on a new project, the 74AC11280N is the perfect choice for all your digital arithmetic circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to physical damage, making the product suitable for industrial environments.

No. of Bits: 9

With 9 bits, this product offers sufficient accuracy and precision for arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with most systems and easy to integrate.

Propagation Delay (tpd): 10.9 ns

Fast propagation delay ensures quick response times, ideal for applications where speed is essential.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, enhancing reliability and flexibility of use.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Digital Arithmetic Circuits 74AC11280N attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

AC

JESD-30 Code:

R-PDIP-T14

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

10.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

74AC11280N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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