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CD74HC280MTG4

Texas Instruments

CD74HC280MTG4 by Texas Instruments

CD74HC280MTG4 by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 300 ns. It operates within a temperature range of -55 to 125 °C and has a supply voltage range of 2-6 V. This CMOS technology device is ideal for military-grade applications requiring fast arithmetic processing in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,743 parts In-Stock

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Digiode

USA . 3,742 parts In-Stock

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Andel Nordic

Denmark . 594 parts In-Stock

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$2.652

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$2.546

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$2.546

594

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$2.546

Northwest PG Solutions

USA . 1,066 parts In-Stock

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$2.884

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One Stop Electronics

USA . 1,610 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 682 parts In-Stock

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Parana Technologies

USA . 1,767 parts In-Stock

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$24.714

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$25.382

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DigiPath Technology Company

USA . 1,500 parts In-Stock

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$27.214

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ChromeModa Solutions

Germany . 2,395 parts In-Stock

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$27.769

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$22.771

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IDEA Electronic Components Group

UK . 180 parts In-Stock

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$27.769

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$26.381

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$24.992

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Corphita

USA . 4,871 parts In-Stock

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Native Components

USA . 264 parts In-Stock

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Overview

Upgrade your digital arithmetic circuits with the CD74HC280MTG4 from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in a compact rectangular package. This versatile component offers 9 bits of precision with a nominal supply voltage of 4.5V, making it ideal for a wide range of applications. With fast propagation delay and durable construction, this military-grade CMOS device ensures optimal performance in extreme temperatures. Trust Texas Instruments to provide the value and benefits you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

No. of Bits: 9

With a high number of bits, this product can handle complex arithmetic calculations and provide accurate results.

Nominal Supply Voltage / Vsup (V): 4.5

Operates efficiently at a moderate supply voltage, reducing power consumption and enhancing performance.

Propagation Delay (tpd): 300 ns

The short propagation delay ensures quick processing of arithmetic operations, making the product efficient.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for demanding applications where heat dissipation is a concern.

Temperature Grade: MILITARY

Meets military-grade standards for reliability and ruggedness, ensuring consistent performance in harsh environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it ideal for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits CD74HC280MTG4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC280MTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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