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SNJ54HC85FK

Texas Instruments

SNJ54HC85FK by Texas Instruments

SNJ54HC85FK by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals in a square chip carrier package. It operates b/w -55°C to 125°C, suitable for military-grade applications. With power supplies ranging from 2V to 6V, it is ideal for high-reliability systems requiring precise arithmetic functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,091 parts In-Stock

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4,091

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Digiode

USA . 2,380 parts In-Stock

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2,380

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 999 parts In-Stock

1+ parts

$10.199

100+ parts

-

1k+ parts

$9.791

10k+ parts

$9.791

999

$10.199

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$9.791

$9.791

AZTECH Wire

Italy . 290 parts In-Stock

1+ parts

$11.929

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290

$11.929

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Parana Technologies

USA . 56 parts In-Stock

1+ parts

$22.995

100+ parts

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$23.645

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56

$22.995

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$23.645

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ChromeModa Solutions

Germany . 4,822 parts In-Stock

1+ parts

$25.837

100+ parts

$21.186

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4,822

$25.837

$21.186

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IDEA Electronic Components Group

UK . 365 parts In-Stock

1+ parts

$25.837

100+ parts

$24.545

1k+ parts

$23.253

10k+ parts

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365

$25.837

$24.545

$23.253

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One Stop Electronics

USA . 733 parts In-Stock

1+ parts

$57.000

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733

$57.000

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Corphita

USA . 4,719 parts In-Stock

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4,719

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DigiPath Technology Company

USA . 1,909 parts In-Stock

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$23.295

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1,909

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$23.295

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Overview

Upgrade your digital arithmetic circuits with the high-quality SNJ54HC85FK from Texas Instruments. Designed with precision and reliability in mind, this chip carrier package offers advanced performance and durability for a wide range of applications. Whether you're working on military-grade projects or industrial automation systems, this product ensures optimal functionality and efficiency. Trust Texas Instruments to deliver top-notch solutions that exceed expectations. Experience the difference with the SNJ54HC85FK.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides high thermal conductivity and excellent electrical insulation, making it suitable for high temperature and high reliability applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing assembly time.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure reliability and consistency in performance, making this product suitable for critical military and aerospace applications.

Power Supplies (V): 2/6

Versatile power supply options allow for flexibility in different operating conditions, making it suitable for a variety of applications.

No. of Terminals: 20

Sufficient terminals provide connectivity options for various input and output signals, enhancing the functionality of the device.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a compact and portable form factor, ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh thermal environments and extended operation times.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: QUAD

Quad terminal position layout allows for easy PCB routing and soldering, facilitating efficient assembly and maintenance.

Temperature Grade: MILITARY

Military-grade temperature range and reliability standards ensure durability and performance in demanding military applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient and reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainability in manufacturing processes.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with common PCB layouts and components, facilitating easy integration into existing designs.

Technical Specifications

Digital Arithmetic Circuits SNJ54HC85FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ54HC85FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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