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74AC11181DWR

Texas Instruments

74AC11181DWR by Texas Instruments

74AC11181DWR by Texas Instruments is a 4-bit digital arithmetic circuit with a nominal voltage of 5V and propagation delay of 19.8ns. This CMOS technology chip operates in industrial temperature range (-40 to 85°C) and is suitable for applications requiring fast arithmetic calculations in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,305 parts In-Stock

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5,305

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Digiode

USA . 1,854 parts In-Stock

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1,854

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Distributors (Availability)

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AZTECH Wire

Italy . 644 parts In-Stock

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$16.013

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644

$16.013

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One Stop Electronics

USA . 523 parts In-Stock

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$19.000

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523

$19.000

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Parana Technologies

USA . 821 parts In-Stock

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$29.469

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$2,736.624

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$26.522

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821

$29.469

$2,736.624

$26.522

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DigiPath Technology Company

USA . 149 parts In-Stock

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$32.449

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149

$32.449

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ChromeModa Solutions

Germany . 878 parts In-Stock

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$33.111

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$27.151

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878

$33.111

$27.151

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IDEA Electronic Components Group

UK . 820 parts In-Stock

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$33.111

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$31.455

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$29.800

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820

$33.111

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$29.800

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Northwest PG Solutions

USA . 1,450 parts In-Stock

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Corphita

USA . 896 parts In-Stock

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Native Components

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Overview

Unlock the power of digital arithmetic circuits with the Texas Instruments 74AC11181DWR. Designed with precision and reliability in mind, this product offers top-notch quality and performance that you can trust. Perfect for a wide range of applications, this device is a versatile solution for your circuit design needs. Experience the value and benefits of Texas Instruments technology with this innovative product, delivering efficiency and accuracy for your projects. Choose Texas Instruments for superior products that enhance your designs and exceed your expectations.

Feature Benefit Bullets

No. of Bits: 4

Having 4 bits allows for a range of values to be processed, making this product suitable for various applications requiring arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard voltage levels in many electronic systems, ensuring easy integration.

Propagation Delay (tpd): 19.8 ns

With a low propagation delay, this product provides fast processing speeds, which is crucial in digital arithmetic circuits where quick calculations are required.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges (-40 to 85°C) ensures reliability and performance in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits 74AC11181DWR attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS

Family:

AC

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

19.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

74AC11181DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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