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SN74ALS677ANTP3

Texas Instruments

SN74ALS677ANTP3 by Texas Instruments

SN74ALS677ANTP3 by Texas Instruments is a TTL digital arithmetic circuit with 24 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. Its through-hole terminal form and 2.54mm pitch offer reliable connectivity in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,138 parts In-Stock

1+ parts

-

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2,138

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Digiode

USA . 2,107 parts In-Stock

1+ parts

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2,107

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,432 parts In-Stock

1+ parts

$9.813

100+ parts

-

1k+ parts

$9.421

10k+ parts

$9.421

5,432

$9.813

-

$9.421

$9.421

AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$15.615

100+ parts

-

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623

$15.615

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Parana Technologies

USA . 2,276 parts In-Stock

1+ parts

$16.104

100+ parts

-

1k+ parts

$16.433

10k+ parts

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2,276

$16.104

-

$16.433

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DigiPath Technology Company

USA . 1,033 parts In-Stock

1+ parts

$17.732

100+ parts

$16.314

1k+ parts

-

10k+ parts

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1,033

$17.732

$16.314

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IDEA Electronic Components Group

UK . 1,109 parts In-Stock

1+ parts

$18.094

100+ parts

$17.189

1k+ parts

$16.285

10k+ parts

-

1,109

$18.094

$17.189

$16.285

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ChromeModa Solutions

Germany . 60 parts In-Stock

1+ parts

$18.094

100+ parts

$14.837

1k+ parts

-

10k+ parts

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60

$18.094

$14.837

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One Stop Electronics

USA . 1,210 parts In-Stock

1+ parts

$59.000

100+ parts

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1,210

$59.000

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Corphita

USA . 815 parts In-Stock

1+ parts

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815

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Overview

Unlock the power of digital arithmetic circuits with the SN74ALS677ANTP3 by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers reliability and precision in every component. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers looking for efficient and accurate solutions. Whether you're working on industrial automation or consumer electronics, the SN74ALS677ANTP3 provides the performance and durability you need. Upgrade your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement within electronic devices or circuit boards.

No. of Terminals: 24

Having a sufficient number of terminals allows for versatile connectivity and compatibility with different systems.

Package Style (Meter): IN-LINE

The in-line package style offers a streamlined and compact design, saving space and facilitating efficient circuit layout.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can perform reliably in various environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively even in colder conditions.

Terminal Position: DUAL

Dual terminal positions provide added flexibility in connecting the product to other components or systems.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures the product can meet the requirements of standard commercial applications.

Technology: TTL

TTL technology offers fast and reliable digital signal processing, making the product suitable for high-speed arithmetic computations.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections, enhancing the product's overall durability and longevity.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy soldering and assembly, ensuring compatibility with common electronic components.

Technical Specifications

Digital Arithmetic Circuits SN74ALS677ANTP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS677ANTP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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