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SN74AS280DRE4

Texas Instruments

SN74AS280DRE4 by Texas Instruments

SN74AS280DRE4 by Texas Instruments is a 9-bit digital arithmetic circuit with 11ns propagation delay. Operating at 5V, it has a max power supply current of 35mA and output characteristics in 3-STATE. This TTL technology chip is ideal for applications requiring fast arithmetic calculations in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,619 parts In-Stock

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Digiode

USA . 4,607 parts In-Stock

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4,607

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Distributors (Availability)

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AZTECH Wire

Italy . 436 parts In-Stock

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$8.022

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436

$8.022

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Parana Technologies

USA . 398 parts In-Stock

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$9.202

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$9.843

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398

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DigiPath Technology Company

USA . 2,085 parts In-Stock

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$10.132

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$9.322

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2,085

$10.132

$9.322

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ChromeModa Solutions

Germany . 1,999 parts In-Stock

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$10.339

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$8.478

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1,999

$10.339

$8.478

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IDEA Electronic Components Group

UK . 766 parts In-Stock

1+ parts

$10.339

100+ parts

$9.822

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$9.305

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766

$10.339

$9.822

$9.305

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One Stop Electronics

USA . 1,102 parts In-Stock

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$52.000

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1,102

$52.000

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Corphita

USA . 4,440 parts In-Stock

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Microchip USA

USA . 238 parts In-Stock

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Overview

Experience superior performance and reliability with the SN74AS280DRE4 from Texas Instruments, a leading manufacturer in the industry of digital arithmetic circuits. This versatile product is designed to meet the demands of various applications, offering exceptional value and benefits to customers. With its high-quality construction, 9 bits, and 3-state output characteristics, this product provides efficient operation and precise results. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations, making your projects a success every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that protects the internal components of the circuit.

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards.

No. of Bits: 9

Provides a high level of precision and accuracy in digital calculations.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage for consistent performance.

Load Capacitance (CL): 50 pF

Optimal capacitance for efficient operation.

Propagation Delay (tpd): 11 ns

Fast response time for quick computations.

Output Characteristics: 3-STATE

Allows for tri-state output, offering flexibility in circuit design.

Technology: TTL

Uses transistor-transistor logic for reliable operation.

Technical Specifications

Digital Arithmetic Circuits SN74AS280DRE4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

AS

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74AS280DRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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