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SN54HC679J-00

Texas Instruments

SN54HC679J-00 by Texas Instruments

SN54HC679J-00 by Texas Instruments is a 12-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 240ns. It is designed for military-grade applications, operates in temperatures from -55 to 125°C, and has inverted output polarity. The package style is in-line with through-hole terminals, making it suitable for various electronic systems requiring high reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,028 parts In-Stock

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4,028

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Digiode

USA . 111 parts In-Stock

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111

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Distributors (Availability)

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Andel Nordic

Denmark . 2,390 parts In-Stock

1+ parts

$7.032

100+ parts

-

1k+ parts

$6.751

10k+ parts

$6.751

2,390

$7.032

-

$6.751

$6.751

AZTECH Wire

Italy . 397 parts In-Stock

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$12.391

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397

$12.391

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Parana Technologies

USA . 1,337 parts In-Stock

1+ parts

$22.957

100+ parts

$2,131.874

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$20.661

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1,337

$22.957

$2,131.874

$20.661

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DigiPath Technology Company

USA . 114 parts In-Stock

1+ parts

$25.278

100+ parts

$23.256

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114

$25.278

$23.256

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ChromeModa Solutions

Germany . 2,121 parts In-Stock

1+ parts

$25.794

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$21.151

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2,121

$25.794

$21.151

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IDEA Electronic Components Group

UK . 927 parts In-Stock

1+ parts

$25.794

100+ parts

$24.504

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$23.215

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927

$25.794

$24.504

$23.215

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One Stop Electronics

USA . 544 parts In-Stock

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$43.000

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544

$43.000

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Corphita

USA . 4,197 parts In-Stock

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Overview

Unlock the power of advanced digital arithmetic circuits with the SN54HC679J-00 by Texas Instruments. Renowned for their top-notch quality, Texas Instruments delivers cutting-edge technology that is reliable and efficient. Ideal for a wide range of applications, this product offers unmatched value to customers seeking high-performance solutions. Experience seamless operation and enhanced functionality with the SN54HC679J-00, setting new standards in the world of digital arithmetic circuits. Choose Texas Instruments for excellence you can trust.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliability in various environmental conditions.

No. of Bits: 12

Offers a high level of precision and accuracy for numerical calculations.

Nominal Supply Voltage / Vsup (V): 5

Suitable voltage level for efficient performance and power consumption.

Propagation Delay (tpd): 240 ns

Low propagation delay helps in quick response time for arithmetic calculations.

Temperature Grade: MILITARY

Designed to operate in extreme temperature conditions, making it suitable for military and aerospace applications.

Technical Specifications

Digital Arithmetic Circuits SN54HC679J-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH INHIBIT

Family:

HC/UH

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

12

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN54HC679J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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