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SN74S381S

Texas Instruments

SN74S381S by Texas Instruments

SN74S381S by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals and a supply voltage of 5V. It comes in a rectangular metal package style, suitable for surface mount applications. Operating temperature ranges from 0 to 70°C, making it ideal for commercial-grade electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,954 parts In-Stock

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6,954

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Digiode

USA . 4,462 parts In-Stock

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4,462

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 578 parts In-Stock

1+ parts

$7.048

100+ parts

-

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578

$7.048

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Andel Nordic

Denmark . 1,562 parts In-Stock

1+ parts

$9.238

100+ parts

-

1k+ parts

$8.868

10k+ parts

$8.868

1,562

$9.238

-

$8.868

$8.868

Parana Technologies

USA . 184 parts In-Stock

1+ parts

$30.232

100+ parts

-

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$68.651

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184

$30.232

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$68.651

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DigiPath Technology Company

USA . 1,179 parts In-Stock

1+ parts

$33.290

100+ parts

$30.626

1k+ parts

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1,179

$33.290

$30.626

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ChromeModa Solutions

Germany . 2,858 parts In-Stock

1+ parts

$33.969

100+ parts

$27.855

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2,858

$33.969

$27.855

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IDEA Electronic Components Group

UK . 590 parts In-Stock

1+ parts

$33.969

100+ parts

$32.271

1k+ parts

$30.572

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590

$33.969

$32.271

$30.572

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One Stop Electronics

USA . 1,288 parts In-Stock

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$39.000

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1,288

$39.000

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Corphita

USA . 178 parts In-Stock

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178

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Overview

Enhance your digital arithmetic circuits with the SN74S381S by Texas Instruments. Experience top-quality manufacturing and cutting-edge technology in a rectangular flatpack package, making it perfect for surface mount applications. This versatile component operates at nominal 5V supply voltage, delivering reliable performance in commercial-grade temperature ranges. Whether you're designing calculators, computers, or data processing systems, the SN74S381S offers unparalleled value, efficiency, and precision for all your digital arithmetic needs. Trust Texas Instruments for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides excellent heat dissipation, ensuring the circuit operates at optimal temperature for improved performance and reliability.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and reducing overall system size.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts and facilitates easy assembly in various electronic devices.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V offers compatibility with a wide range of electronic systems and simplifies power management.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows the circuit to function reliably even in demanding environments without the risk of overheating.

Technology: TTL

TTL technology provides fast switching speeds and low power consumption, making it suitable for applications requiring high-speed arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SN74S381S attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-MDFP-F20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

METAL

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74S381S Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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