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SN74LS280J-00

Texas Instruments

SN74LS280J-00 by Texas Instruments

SN74LS280J-00 by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 45 ns. Operating at a supply voltage range of 4.75V to 5.25V, it has a load capacitance of 15 pF and operates in commercial temperature grades. This TTL technology chip is commonly used in applications requiring fast arithmetic calculations and precise timing control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,586 parts In-Stock

1+ parts

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6,586

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Digiode

USA . 1,200 parts In-Stock

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1,200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,816 parts In-Stock

1+ parts

$10.714

100+ parts

$994.941

1k+ parts

$9.642

10k+ parts

-

1,816

$10.714

$994.941

$9.642

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DigiPath Technology Company

USA . 1,920 parts In-Stock

1+ parts

$11.797

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1,920

$11.797

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ChromeModa Solutions

Germany . 6,597 parts In-Stock

1+ parts

$12.038

100+ parts

$9.871

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-

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6,597

$12.038

$9.871

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IDEA Electronic Components Group

UK . 2,053 parts In-Stock

1+ parts

$12.038

100+ parts

$11.436

1k+ parts

$10.834

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-

2,053

$12.038

$11.436

$10.834

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AZTECH Wire

Italy . 280 parts In-Stock

1+ parts

$12.684

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280

$12.684

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Andel Nordic

Denmark . 752 parts In-Stock

1+ parts

$31.037

100+ parts

-

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$29.795

10k+ parts

$29.795

752

$31.037

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$29.795

$29.795

One Stop Electronics

USA . 1,590 parts In-Stock

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$43.000

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1,590

$43.000

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Corphita

USA . 4,979 parts In-Stock

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4,979

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Overview

Enhance your digital arithmetic circuits with the SN74LS280J-00 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for a variety of applications, this product offers unmatched precision and performance. Experience the value and benefits of this advanced component, providing customers with superior results and efficiency. Upgrade your projects with the SN74LS280J-00 and discover the difference Texas Instruments can make in your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliable operation in various environments.

No. of Bits: 9

Offers high precision and accuracy in arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power sources, making it easy to integrate into existing systems.

Propagation Delay (tpd): 45 ns

Ensures fast processing speeds, ideal for applications that require quick calculations.

Temperature Grade: COMMERCIAL

Suitable for use in commercial electronic devices, meeting industry standards for performance and reliability.

Technical Specifications

Digital Arithmetic Circuits SN74LS280J-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

LS

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74LS280J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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