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SN74F280BD-00

Texas Instruments

SN74F280BD-00 by Texas Instruments

SN74F280BD-00 by Texas Instruments is a 9-bit digital arithmetic circuit with 11ns propagation delay. It operates at a supply voltage range of 4.75V to 5.25V and has a temperature range of 0°C to 70°C. This small outline package is ideal for commercial applications requiring fast arithmetic computations.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,553 parts In-Stock

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Digiode

USA . 2,608 parts In-Stock

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2,608

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Andel Nordic

Denmark . 597 parts In-Stock

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$6.442

100+ parts

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$6.184

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$6.184

597

$6.442

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$6.184

$6.184

Parana Technologies

USA . 2,138 parts In-Stock

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$10.577

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$11.076

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$10.577

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DigiPath Technology Company

USA . 202 parts In-Stock

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$11.646

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$10.715

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202

$11.646

$10.715

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ChromeModa Solutions

Germany . 2,875 parts In-Stock

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$11.884

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$9.745

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2,875

$11.884

$9.745

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IDEA Electronic Components Group

UK . 246 parts In-Stock

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$11.884

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$11.290

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$10.696

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246

$11.884

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$10.696

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AZTECH Wire

Italy . 309 parts In-Stock

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$16.967

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One Stop Electronics

USA . 1,269 parts In-Stock

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$55.000

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Corphita

USA . 1,767 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the high-quality SN74F280BD-00 from Texas Instruments. With a reputation for excellence, Texas Instruments delivers reliable and efficient products that cater to various applications. This rectangular package with 9 bits offers customers a valuable solution with a propagation delay of 11ns, ensuring quick and accurate results. Whether you're working on commercial projects or personal endeavors, this small outline package is designed to meet your needs with its complementary output polarity and wide operating temperature range. Upgrade your circuitry today with the SN74F280BD-00 and experience the advantages of premium technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package sturdy and durable, ensuring the circuit's longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts, making integration straightforward.

No. of Bits: 9

Having 9 bits allows for higher precision and accuracy in calculations, making this circuit suitable for complex arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operating at 5V makes this circuit compatible with common power sources, ensuring easy integration into existing systems.

No. of Terminals: 14

Having 14 terminals provides sufficient connectivity options for input and output signals, enhancing versatility in circuit design.

Package Style: SMALL OUTLINE

Small outline package style saves valuable space on the PCB, enabling compact and efficient designs.

Propagation Delay (tpd): 11 ns

Low propagation delay of 11 ns ensures fast processing speed, ideal for applications requiring real-time arithmetic calculations.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C allows for reliable performance in varied environmental conditions.

Minimum Operating Temperature: 0 °C

Lowest operating temperature of 0°C ensures functionality even in colder environments, increasing the circuit's usability.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connection options, enhancing the circuit's robustness.

Maximum Seated Height: 1.75 mm

Low seated height of 1.75 mm reduces the overall profile of the circuit, ideal for space-constrained applications.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies the interfacing with other digital circuits, ensuring seamless integration within the system.

Minimum Supply Voltage (Vsup): 4.75 V

With a minimum supply voltage of 4.75V, the circuit retains functionality even with slight voltage fluctuations, ensuring stability in operation.

Length: 8.65 mm

Compact length of 8.65 mm contributes to the overall small form factor, making it suitable for applications with tight spatial constraints.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance under standard operating conditions, making it suitable for a wide range of commercial applications.

Technology: TTL

TTL technology offers high-speed operation and compatibility with a wide range of digital systems, enhancing the versatility of the circuit.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto the PCB, simplifying the assembly process and ensuring secure connections.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27 mm allows for precise and compact placement on the PCB, optimizing the layout for efficient signal routing.

Maximum Supply Voltage (Vsup): 5.25 V

With a maximum supply voltage of 5.25V, the circuit can handle higher voltage levels without compromising its performance, ensuring robustness in operation.

Technical Specifications

Digital Arithmetic Circuits SN74F280BD-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

F/FAST

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SN74F280BD-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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