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SN74HC680NP3

Texas Instruments

SN74HC680NP3 by Texas Instruments

SN74HC680NP3 by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals in an in-line rectangular package. It operates b/w -40°C to 85°C, making it suitable for industrial applications requiring precise calculations and data processing. The through-hole terminal form and 2.54mm pitch enhance its reliability and performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,745 parts In-Stock

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Vyrian

USA . 4,605 parts In-Stock

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4,605

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Distributors (Availability)

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Andel Nordic

Denmark . 1,589 parts In-Stock

1+ parts

$7.509

100+ parts

-

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$7.208

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$7.208

1,589

$7.509

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$7.208

$7.208

Parana Technologies

USA . 2,285 parts In-Stock

1+ parts

$11.015

100+ parts

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$11.477

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2,285

$11.015

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$11.477

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AZTECH Wire

Italy . 221 parts In-Stock

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$11.430

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221

$11.430

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DigiPath Technology Company

USA . 1,155 parts In-Stock

1+ parts

$12.128

100+ parts

$11.158

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1,155

$12.128

$11.158

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ChromeModa Solutions

Germany . 5,588 parts In-Stock

1+ parts

$12.376

100+ parts

$10.148

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5,588

$12.376

$10.148

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IDEA Electronic Components Group

UK . 1,601 parts In-Stock

1+ parts

$12.376

100+ parts

$11.757

1k+ parts

$11.138

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1,601

$12.376

$11.757

$11.138

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One Stop Electronics

USA . 421 parts In-Stock

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$35.000

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421

$35.000

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Corphita

USA . 4,015 parts In-Stock

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4,015

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Overview

Unlock the power of digital arithmetic circuits with the SN74HC680NP3 by Texas Instruments. Designed with precision and reliability in mind, this product offers unparalleled performance in a variety of industrial applications. With a durable plastic/epoxy package body and 20 terminals in an in-line rectangular shape, this CMOS technology ensures optimal functionality even in extreme temperatures. Experience the value and benefits of Texas Instruments' expertise in digital circuits with the SN74HC680NP3 - your solution for efficient and reliable arithmetic processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy and efficient PCB layout and integration into existing systems.

No. of Terminals: 20

With 20 terminals, this product offers flexibility in connectivity and allows for versatile circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style is space-efficient and suitable for applications with limited board space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can operate in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal positions provide redundancy and improved reliability in case of a single terminal failure.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product is suitable for harsh industrial environments with varying temperature ranges.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in data processing.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong mechanical connection to the PCB, ensuring reliability in high-vibration environments.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy soldering and maintenance, making the product user-friendly and cost-effective.

Technical Specifications

Digital Arithmetic Circuits SN74HC680NP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC680NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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