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SNJ54ACT11881J

Texas Instruments

SNJ54ACT11881J by Texas Instruments

SNJ54ACT11881J by Texas Instruments is a CMOS digital arithmetic circuit with 28 terminals and a supply voltage of 5V. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications requiring high reliability and performance. The package style is in-line rectangular ceramic, ideal for robust through-hole mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,922 parts In-Stock

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Digiode

USA . 3,127 parts In-Stock

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3,127

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Distributors (Availability)

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AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$5.444

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884

$5.444

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Andel Nordic

Denmark . 247 parts In-Stock

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$8.124

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$7.799

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$7.799

247

$8.124

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$7.799

$7.799

Parana Technologies

USA . 719 parts In-Stock

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$14.271

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$14.725

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719

$14.271

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$14.725

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DigiPath Technology Company

USA . 2,157 parts In-Stock

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$15.714

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2,157

$15.714

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IDEA Electronic Components Group

UK . 785 parts In-Stock

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$16.035

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$15.233

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$14.432

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785

$16.035

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$14.432

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ChromeModa Solutions

Germany . 704 parts In-Stock

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$16.035

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$13.149

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704

$16.035

$13.149

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One Stop Electronics

USA . 827 parts In-Stock

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$38.000

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$38.000

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Corphita

USA . 896 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the SNJ54ACT11881J by Texas Instruments. Crafted with precision and quality materials, this product offers unparalleled reliability and performance in a wide range of applications. Whether you're looking to enhance your computing systems or streamline your data processing, this versatile component delivers exceptional value and benefits. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides durability and high thermal conductivity, making it suitable for high temperature applications.

Screening Level: 38535Q/M; 38534H; 883B

This screening level ensures that the product meets stringent quality standards, making it reliable for use in critical military or aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

Having a consistent supply voltage of 5V simplifies circuit design and ensures stable operation of the digital arithmetic circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and operate reliably in extreme temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the digital arithmetic circuits efficient and reliable for various applications.

Technical Specifications

Digital Arithmetic Circuits SNJ54ACT11881J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T28

Logic IC Type:

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54ACT11881J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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