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SNJ54ALS679J

Texas Instruments

SNJ54ALS679J by Texas Instruments

SNJ54ALS679J by Texas Instruments is a 12-bit digital arithmetic circuit with a propagation delay of 40ns. Operating at a voltage range of 4.5V to 5.5V, it is ideal for military-grade applications requiring inverted output polarity and a load capacitance of 50pF. The package style is in-line with through-hole terminals, suitable for temperature ranges from -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,001 parts In-Stock

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Digiode

USA . 447 parts In-Stock

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447

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Andel Nordic

Denmark . 535 parts In-Stock

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$2.129

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$2.044

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$2.044

535

$2.129

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$2.044

AZTECH Wire

Italy . 389 parts In-Stock

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$11.199

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Parana Technologies

USA . 1,331 parts In-Stock

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$18.513

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$18.625

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DigiPath Technology Company

USA . 1,812 parts In-Stock

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$20.385

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$18.754

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ChromeModa Solutions

Germany . 6,649 parts In-Stock

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$20.801

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$17.057

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$20.801

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IDEA Electronic Components Group

UK . 513 parts In-Stock

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$20.801

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$19.761

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$18.721

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513

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One Stop Electronics

USA . 1,270 parts In-Stock

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$44.000

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Corphita

USA . 2,457 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the top-notch quality of the SNJ54ALS679J by Texas Instruments. Crafted with precision using ceramic and glass-sealed materials, this product guarantees reliability and durability. Ideal for military-grade applications, this 12-bit circuit offers unmatched performance with a fast propagation delay of 40 ns. With a nominal supply voltage of 5V and inverted output polarity, the SNJ54ALS679J provides customers with exceptional value and efficiency. Upgrade your projects with this innovative solution today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent protection and durability for the internal components, ensuring long-term reliability.

No. of Bits: 12

Offers a high resolution for accurate digital arithmetic calculations, making it suitable for complex applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with most systems and easy to integrate.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, allowing for use in harsh environments without compromising performance.

Technology: TTL

Uses TTL technology, known for its reliability and fast switching speeds, making it ideal for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits SNJ54ALS679J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH INHIBIT

Family:

ALS

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

12

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

28 mA

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54ALS679J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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