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M38510/34701SSA

Texas Instruments

M38510/34701SSA by Texas Instruments

M38510/34701SSA by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 15ns. It operates in military-grade temperature range from -55 to 125°C, suitable for applications requiring inverted output polarity and TTL technology. This flatpack package has 20 terminals and supports a nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,834 parts In-Stock

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Digiode

USA . 2,686 parts In-Stock

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2,686

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Anansix

USA . 855 parts In-Stock

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855

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Distributors (Availability)

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Andel Nordic

Denmark . 2,148 parts In-Stock

1+ parts

$6.847

100+ parts

-

1k+ parts

$6.573

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$6.573

2,148

$6.847

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$6.573

$6.573

AZTECH Wire

Italy . 465 parts In-Stock

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$14.035

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465

$14.035

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Parana Technologies

USA . 1,370 parts In-Stock

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$23.912

100+ parts

$2,220.558

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$21.520

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1,370

$23.912

$2,220.558

$21.520

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DigiPath Technology Company

USA . 1,981 parts In-Stock

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$26.330

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1,981

$26.330

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ChromeModa Solutions

Germany . 3,948 parts In-Stock

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$26.867

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$22.031

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3,948

$26.867

$22.031

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IDEA Electronic Components Group

UK . 1,629 parts In-Stock

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$26.867

100+ parts

$25.524

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$24.180

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1,629

$26.867

$25.524

$24.180

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One Stop Electronics

USA . 1,213 parts In-Stock

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$54.000

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Corphita

USA . 2,065 parts In-Stock

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2,065

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Overview

Experience the superior quality and reliability of Texas Instruments with the M38510/34701SSA digital arithmetic circuit. Perfect for military-grade applications, this product offers unparalleled performance and precision. With a flatpack package style and inverted output polarity, this product is designed to meet the toughest demands. Trust Texas Instruments for cutting-edge technology and exceptional value. Choose the M38510/34701SSA for your next project and experience the difference.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection to the components inside the package, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable allows for easy and compact integration of the circuit into various electronic devices.

Package Shape: RECTANGULAR

The rectangular shape makes it easier to design and install the circuit in a systematic manner within a device.

No. of Bits: 8

Having 8 bits allows for processing a wider range of numerical values and calculations, making this product versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common voltage in many electronic systems, making it compatible with a wide range of devices.

Propagation Delay (tpd): 15 ns

With a low propagation delay, this circuit can perform calculations quickly, enhancing the overall speed and efficiency of the device it is integrated into.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the circuit can function reliably even in harsh environmental conditions, making it suitable for a variety of applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the circuit to continue functioning even in extremely cold environments, increasing its versatility.

Terminal Position: DUAL

The dual terminal position provides flexibility in connecting the circuit to other components, allowing for efficient integration into different systems.

Output Polarity: INVERTED

The inverted output polarity can be beneficial in certain applications where complementary signals are needed for accurate data processing.

Technology: TTL

The use of TTL technology ensures reliable performance and compatibility with other TTL-based components, making it a preferred choice for many design engineers.

Technical Specifications

Digital Arithmetic Circuits M38510/34701SSA attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDFP-F20

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class S

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

M38510/34701SSA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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