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M38510/15001BEA

Texas Instruments

M38510/15001BEA by Texas Instruments

M38510/15001BEA by Texas Instruments is a 4-bit digital arithmetic circuit with MIL-M-38510 Class B screening. It operates at a supply voltage range of 4.5V to 5.5V and has a propagation delay of 49ns. Ideal for military applications due to its MILITARY temperature grade and TTL technology, it comes in an IN-LINE package style with 16 terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,416 parts In-Stock

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Digiode

USA . 2,777 parts In-Stock

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Anansix

USA . 531 parts In-Stock

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531

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One Stop Electronics

USA . 1,580 parts In-Stock

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$3.000

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$3.000

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Andel Nordic

Denmark . 3,991 parts In-Stock

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$3.125

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$3.000

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Parana Technologies

USA . 1,949 parts In-Stock

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$13.029

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$1,209.913

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$11.726

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$1,209.913

$11.726

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DigiPath Technology Company

USA . 2,262 parts In-Stock

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$14.346

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$13.199

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ChromeModa Solutions

Germany . 1,744 parts In-Stock

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$14.639

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$12.004

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IDEA Electronic Components Group

UK . 1,499 parts In-Stock

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$14.639

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$13.907

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$13.175

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AZTECH Wire

Italy . 654 parts In-Stock

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$16.504

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Corphita

USA . 7,382 parts In-Stock

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UNI Independent Distributors

Spain . 1,497 parts In-Stock

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Overview

Unlock the power of digital arithmetic circuits with the M38510/15001BEA by Texas Instruments. Designed with precision and reliability in mind, this MILITARY-grade component offers unparalleled performance in a variety of applications. From aerospace to defense, this 4-bit marvel delivers fast propagation delays and true output polarity, ensuring seamless operation at temperatures ranging from -55°C to 125°C. Experience the quality and innovation that only Texas Instruments can provide, and elevate your projects to new heights with the M38510/15001BEA.

Feature Benefit Bullets

Screening Level: MIL-M-38510 Class B

This product meets MIL-M-38510 Class B screening level standards, ensuring high reliability and quality performance in military applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and installation in various electronic systems.

No. of Bits: 4

With 4 bits, this product offers sufficient digital precision and accuracy for arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product provides stable and consistent power for its operations.

Propagation Delay (tpd): 49 ns

With a low propagation delay of 49ns, this product ensures fast and efficient processing of arithmetic operations.

Maximum Operating Temperature: 125 °C

Capable of operating at up to 125°C, this product is suitable for high-temperature environments.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product can withstand extreme cold conditions.

Technology: TTL

Utilizing TTL technology, this product offers reliable and well-established digital arithmetic circuitry for accurate computations.

Technical Specifications

Digital Arithmetic Circuits M38510/15001BEA attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

49 ns

Qualification:

Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

M38510/15001BEA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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