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SN74HC147FH4

Texas Instruments

SN74HC147FH4 by Texas Instruments

SN74HC147FH4 by Texas Instruments is a CMOS digital arithmetic circuit in a ceramic chip carrier package. It operates b/w -40°C to 85°C with power supplies of 2-6V. With 20 terminals, it is suitable for industrial applications requiring precise arithmetic calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,963 parts In-Stock

1+ parts

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8,963

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Digiode

USA . 3,510 parts In-Stock

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3,510

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Distributors (Availability)

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Andel Nordic

Denmark . 3,089 parts In-Stock

1+ parts

$7.882

100+ parts

-

1k+ parts

$7.567

10k+ parts

$7.567

3,089

$7.882

-

$7.567

$7.567

AZTECH Wire

Italy . 442 parts In-Stock

1+ parts

$9.346

100+ parts

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442

$9.346

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One Stop Electronics

USA . 790 parts In-Stock

1+ parts

$10.000

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790

$10.000

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Parana Technologies

USA . 1,645 parts In-Stock

1+ parts

$19.985

100+ parts

-

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$19.922

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1,645

$19.985

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$19.922

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DigiPath Technology Company

USA . 1,089 parts In-Stock

1+ parts

$22.006

100+ parts

$20.245

1k+ parts

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1,089

$22.006

$20.245

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IDEA Electronic Components Group

UK . 1,690 parts In-Stock

1+ parts

$22.455

100+ parts

$21.332

1k+ parts

$20.210

10k+ parts

-

1,690

$22.455

$21.332

$20.210

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ChromeModa Solutions

Germany . 329 parts In-Stock

1+ parts

$22.455

100+ parts

$18.413

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329

$22.455

$18.413

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Corphita

USA . 3,934 parts In-Stock

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3,934

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Overview

Discover the unbeatable quality and reliability of Texas Instruments with the SN74HC147FH4 digital arithmetic circuit. Perfect for a wide range of applications, this chip carrier package offers unparalleled performance in industrial settings. With a focus on efficiency and precision, customers can trust in the advanced technology and innovative design of this product to deliver exceptional results every time. Upgrade your projects with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers excellent heat resistance and durability, making it suitable for industrial applications where high temperatures may be present.

Surface Mount: YES

Surface mount technology allows for easy and cost-effective assembly onto PCBs, saving space and reducing overall product size.

Package Shape: SQUARE

Square package shape provides optimal utilization of board space and allows for efficient layout and routing of traces.

Power Supplies (V): 2/6

Support for a wide range of power supply voltages allows for versatility in different operating environments and applications.

No. of Terminals: 20

A higher number of terminals provide more connectivity options and flexibility in interfacing with other components or systems.

Package Style: CHIP CARRIER

Chip carrier package style offers good protection for the circuitry and facilitates easy integration into electronic devices or systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability and performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in a wide range of temperature settings without compromising functionality.

Terminal Position: QUAD

Quad terminal position provides better stability and mechanical support during assembly and operation, reducing the risk of damage or failure.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the circuit will withstand demanding industrial settings and maintain consistent performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and excellent noise immunity, making it suitable for various digital arithmetic circuit applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with RoHS regulations, promoting sustainability and reducing hazardous material usage.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for higher packing density and finer routing, contributing to overall miniaturization and efficiency of the product design.

Technical Specifications

Digital Arithmetic Circuits SN74HC147FH4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74HC147FH4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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