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M38510/31101B2X

Texas Instruments

M38510/31101B2X by Texas Instruments

M38510/31101B2X by Texas Instruments is a 4-bit digital arithmetic circuit with 42ns propagation delay. Operating at a temperature range of -55 to 125°C, it has a supply voltage of 4.5-5.5V and is MILITARY grade for applications requiring high reliability in harsh environments. The chip carrier package style with 20 terminals makes it suitable for military-grade electronics.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,692 parts In-Stock

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Digiode

USA . 1,694 parts In-Stock

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Anansix

USA . 1,543 parts In-Stock

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Andel Nordic

Denmark . 604 parts In-Stock

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$2.353

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One Stop Electronics

USA . 406 parts In-Stock

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AZTECH Wire

Italy . 550 parts In-Stock

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Parana Technologies

USA . 1,910 parts In-Stock

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ChromeModa Solutions

Germany . 1,957 parts In-Stock

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$24.309

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IDEA Electronic Components Group

UK . 1,511 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 1,271 parts In-Stock

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Overview

Unlock the power of digital arithmetic circuits with the M38510/31101B2X by Texas Instruments. Crafted with precision and expertise, this product offers unparalleled quality and reliability that only a trusted manufacturer like Texas Instruments can provide. Ideal for military-grade applications, this chip carrier boasts a fast propagation delay of 42ns and true output polarity, ensuring efficient performance in extreme conditions. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the M38510/31101B2X today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and resistance to high temperatures, making it suitable for demanding military applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during production.

Screening Level: MIL-PRF-38535 Class B

Ensures high reliability and quality standards, meeting stringent military requirements.

Package Shape: SQUARE

Optimal shape for compact designs and efficient use of space on the circuit board.

No. of Bits: 4

Ideal for applications requiring low to moderate precision in calculations.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply that is commonly used in many electronic devices.

No. of Terminals: 20

Provides ample connectivity options for integration with other components in the system.

Package Style (Meter): CHIP CARRIER

Offers protection and easy handling during assembly and maintenance.

Propagation Delay (tpd): 42 ns

Fast signal processing speed, suitable for time-sensitive applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without performance degradation, ensuring reliability in harsh environments.

Minimum Operating Temperature: -55 °C

Can operate in extremely low temperature conditions, suitable for a wide range of environments.

Terminal Position: QUAD

Efficient layout for connectivity and signal flow within the circuit.

Output Polarity: TRUE

Consistent output polarity simplifies circuit design and integration.

Minimum Supply Voltage (Vsup): 4.5 V

Can operate at lower voltage levels, providing flexibility in power supply options.

Temperature Grade: MILITARY

Meets stringent military standards for reliability, performance, and durability.

Technology: TTL

Well-established technology with proven reliability and compatibility with existing systems.

Terminal Form: NO LEAD

Lead-free terminals for compliance with environmental regulations and improved reliability.

Maximum Supply Voltage (Vsup): 5.5 V

Protection against voltage spikes or fluctuations, ensuring stable operation within specified limits.

Technical Specifications

Digital Arithmetic Circuits M38510/31101B2X attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

42 ns

Qualification:

Qualified

Screening Level:

MIL-PRF-38535 Class B

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

M38510/31101B2X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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