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M38510/08201BEX

Texas Instruments

M38510/08201BEX by Texas Instruments

M38510/08201BEX by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 18ns. Operating in a temperature range from -55°C to 125°C, it features a supply voltage of 4.5V to 5.5V and is designed for military-grade applications requiring fast processing speeds in compact spaces. This TTL technology chip comes in a flatpack package style with dual terminals, making it suitable for high-reliability electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 5,604 parts In-Stock

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Vyrian

USA . 5,092 parts In-Stock

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Anansix

USA . 1,840 parts In-Stock

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1,840

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Electronic Expediters

USA . 42 parts In-Stock

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Resion

USA . 1 parts In-Stock

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One Stop Electronics

USA . 2,814 parts In-Stock

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$5.000

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$5.000

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Parana Technologies

USA . 122 parts In-Stock

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$8.619

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$9.287

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122

$8.619

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$9.287

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DigiPath Technology Company

USA . 1,990 parts In-Stock

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$9.490

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$8.731

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1,990

$9.490

$8.731

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IDEA Electronic Components Group

UK . 2,105 parts In-Stock

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$9.684

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$9.200

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$8.716

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2,105

$9.684

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$8.716

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ChromeModa Solutions

Germany . 955 parts In-Stock

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$9.684

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$7.941

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955

$9.684

$7.941

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AZTECH Wire

Italy . 624 parts In-Stock

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$17.176

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UNI Independent Distributors

Spain . 3,398 parts In-Stock

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Corphita

USA . 2,759 parts In-Stock

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Overview

Unlock the power of precision with the M38510/08201BEX by Texas Instruments. Crafted with excellence, this digital arithmetic circuit offers unparalleled reliability and performance. Ideal for military-grade applications, this product boasts a temperature range from -55°C to 125°C, ensuring optimal functionality in harsh environments. With a true output polarity and fast propagation delay of 18ns, you can trust this flatpack package to deliver accurate results every time. Elevate your projects with the trusted quality and cutting-edge technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent protection for the circuitry, ensuring durability and reliability.

Surface Mount: YES

Makes it easier to integrate into modern compact electronic designs.

Screening Level: MIL-M-38510 Class B

Ensures high quality and reliability in demanding military applications.

No. of Bits: 4

Suitable for applications requiring data processing with 4-bit precision.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and stable supply voltage, making it easily compatible with other components.

Maximum Operating Temperature: 125 °C

Capable of withstanding high temperature environments without performance degradation.

Minimum Operating Temperature: -55 °C

Can operate in extremely low temperature conditions, suitable for a wide range of environments.

Propagation Delay (tpd): 18 ns

Provides fast signal processing speed, crucial for time-sensitive applications.

Technology: TTL

Uses TTL technology known for its reliability, simplicity, and compatibility with various systems.

Technical Specifications

Digital Arithmetic Circuits M38510/08201BEX attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

S

JESD-30 Code:

R-GDFP-F16

Length:

19.56 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay (tpd):

18 ns

Qualification:

Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

7.62 mm

Trade Compliance

M38510/08201BEX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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