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M38510/31101SFX

Texas Instruments

M38510/31101SFX by Texas Instruments

M38510/31101SFX by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 42ns. It operates in a temperature range from -55°C to 125°C, suitable for military applications. This TTL technology chip has a supply voltage of 5V and comes in a ceramic, glass-sealed flatpack package with 16 terminals.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,965 parts In-Stock

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Digiode

USA . 5,961 parts In-Stock

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Anansix

USA . 3,672 parts In-Stock

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AZTECH Wire

Italy . 808 parts In-Stock

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$16.769

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808

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Parana Technologies

USA . 261 parts In-Stock

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$27.291

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$34.236

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ChromeModa Solutions

Germany . 1,768 parts In-Stock

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$30.664

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$25.144

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IDEA Electronic Components Group

UK . 1,474 parts In-Stock

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$30.664

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$29.131

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$27.598

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$30.664

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One Stop Electronics

USA . 1,173 parts In-Stock

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$52.000

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Corphita

USA . 8,203 parts In-Stock

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DigiPath Technology Company

USA . 1,578 parts In-Stock

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$27.647

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UNI Independent Distributors

Spain . 67 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the M38510/31101SFX by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-tier products for various applications. This MILITARY-grade digital arithmetic circuit offers a fast propagation delay of 42 ns, ensuring efficient performance in extreme temperatures ranging from -55°C to 125°C. With a nominal supply voltage of 5V and true output polarity, this component provides unmatched value and benefits for your electronic projects. Upgrade your designs with Texas Instruments' trusted technology and experience enhanced functionality like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material enhances the durability and reliability of the digital arithmetic circuit, making it suitable for harsh environments.

No. of Bits: 4

With 4 bits, this digital arithmetic circuit can handle a reasonable range of calculations with precision and efficiency.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures stable and consistent performance of the digital arithmetic circuit.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the digital arithmetic circuit to function reliably even in elevated temperature conditions.

Technology: TTL

Utilizing TTL technology ensures fast and efficient operation of the digital arithmetic circuit, making it suitable for various computational tasks.

Technical Specifications

Digital Arithmetic Circuits M38510/31101SFX attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class S

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

M38510/31101SFX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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