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SN74ALS521N

Texas Instruments

SN74ALS521N by Texas Instruments

SN74ALS521N by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 22ns at 5V. It features a 3-STATE output and operates within a temperature range of 0 to 70°C. This TTL technology chip is commonly used in applications requiring fast arithmetic operations in commercial-grade environments.

Median Price

$1.492

Lifecycle Status

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USA . 552 parts In-Stock

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Rochester

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DigiKey

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Chip1Stop

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Avnet

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Freelance Electronics

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Digiode

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Component Electronics Inc.

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American Microsemiconductor Inc.

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Forefront Electronics and Design

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Bristol Electronics

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A2Z Electronics, Inc.

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Ampacity Inc.

Singapore . 7,961 parts In-Stock

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$0.600

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Semicontronic

India . 7,417 parts In-Stock

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Corphita

USA . 3,890 parts In-Stock

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Denmark . 1,400 parts In-Stock

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$6.916

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$6.916

Microchip USA

USA . 2,092 parts In-Stock

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$7.995

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Corohmni

South Africa . 458 parts In-Stock

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Parana Technologies

USA . 829 parts In-Stock

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$25.499

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$26.121

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DigiPath Technology Company

USA . 1,040 parts In-Stock

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$28.078

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$25.832

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$28.078

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ChromeModa Solutions

Germany . 2,305 parts In-Stock

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$28.651

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$23.494

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IDEA Electronic Components Group

UK . 1,644 parts In-Stock

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$28.651

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$27.218

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$25.786

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Perfect Parts

USA . 5,793 parts In-Stock

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Kepictronics

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Overview

Unlock the power of digital arithmetic circuits with the SN74ALS521N by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology to meet all your circuit needs. Whether you're working on a complex project or a simple application, this product offers unmatched precision and performance. Say goodbye to technical headaches and hello to seamless operation with the SN74ALS521N. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the circuit, making it suitable for various environments.

Propagation Delay At Nominal Supply:

22 ns - This fast propagation delay ensures quick processing of data, ideal for time-sensitive applications.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy integration and placement within a circuit design.

No. of Bits:

8 - Offers a high level of precision and accuracy in digital calculations.

Nominal Supply Voltage / Vsup (V):

5 - Compatible with standard power supplies, making it easy to incorporate into existing systems.

Load Capacitance (CL):

50 pF - This low capacitance allows for efficient data transmission and reduced signal distortion.

Power Supplies (V):

5 - Provides a stable power source for optimal performance of the circuit.

No. of Terminals:

20 - Sufficient terminals for connecting to other components, enabling versatile configurations.

Package Style (Meter):

IN-LINE - Space-efficient design for compact circuit layouts.

Maximum I (ol):

24 Amp - Can handle high output currents, suitable for demanding applications.

Propagation Delay (tpd):

20 ns - Low propagation delay ensures quick response times and efficient data processing.

Maximum Operating Temperature:

70 °C - Can withstand high temperatures, suitable for a range of operating conditions.

Output Characteristics:

3-STATE - Allows for multiple output states, providing flexibility in circuit design.

Minimum Operating Temperature:

0 °C - Can operate in low-temperature environments, enhancing versatility.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - Provides corrosion resistance and longevity for reliable connections.

Terminal Position:

DUAL - Dual terminal position for enhanced stability and connectivity.

Maximum Seated Height:

5.08 mm - Low profile design for space-saving applications.

Width:

7.62 mm - Compact width for efficient use of circuit board space.

Output Polarity:

INVERTED - Offers inverted output signals for specific circuit requirements.

Minimum Supply Voltage (Vsup):

4.5 V - Can operate at low supply voltages, enabling energy-efficient performance.

Length:

25.4 mm - Suitable length for various circuit layout configurations.

Temperature Grade:

COMMERCIAL - Meets commercial-grade standards for reliability and performance.

Technology:

TTL - Utilizes TTL technology for efficient digital arithmetic operations.

Terminal Form:

THROUGH-HOLE - Through-hole terminals for secure and reliable connections.

Packing Method:

TUBE - Secure packaging to protect the circuit during transportation and storage.

Terminal Pitch:

2.54 mm - Standard terminal pitch for easy integration with other components.

Maximum Supply Voltage (Vsup):

5.5 V - Handles high supply voltages for reliable operation in demanding conditions.

Maximum Power Supply Current (ICC):

19 mA - Low power consumption for energy-efficient performance.

Technical Specifications

Digital Arithmetic Circuits SN74ALS521N attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH PULL-UP RESISTORS ON Q INPUTS; CASCADABLE

Family:

ALS

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

25.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74ALS521N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-264-5251, 5962012645251

NIIN

012645251

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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