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SNJ54LS683W

Texas Instruments

SNJ54LS683W by Texas Instruments

SNJ54LS683W by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals, operating at temperatures from -55 to 125°C. It has a supply voltage of 5V and is suitable for military applications requiring high reliability and performance in surface-mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,376 parts In-Stock

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7,376

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Digiode

USA . 4,584 parts In-Stock

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4,584

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Distributors (Availability)

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Andel Nordic

Denmark . 1,331 parts In-Stock

1+ parts

$11.265

100+ parts

-

1k+ parts

$10.815

10k+ parts

$10.815

1,331

$11.265

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$10.815

$10.815

Parana Technologies

USA . 179 parts In-Stock

1+ parts

$15.708

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$16.073

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179

$15.708

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$16.073

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DigiPath Technology Company

USA . 1,810 parts In-Stock

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$17.296

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1,810

$17.296

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ChromeModa Solutions

Germany . 5,509 parts In-Stock

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$17.649

100+ parts

$14.472

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5,509

$17.649

$14.472

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IDEA Electronic Components Group

UK . 76 parts In-Stock

1+ parts

$17.649

100+ parts

$16.767

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$15.884

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76

$17.649

$16.767

$15.884

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AZTECH Wire

Italy . 299 parts In-Stock

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$18.178

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299

$18.178

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One Stop Electronics

USA . 1,461 parts In-Stock

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$19.000

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Corphita

USA . 2,047 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the SNJ54LS683W from Texas Instruments. Crafted with precision and expertise, this high-quality component offers unparalleled reliability and performance in a variety of applications. Whether you're designing complex systems or enhancing existing projects, this versatile product delivers exceptional value, benefits, and advantages to meet your needs. Take your projects to the next level with the SNJ54LS683W and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers high thermal conductivity and excellent resistance to heat, making it suitable for military-grade applications where reliability and durability are crucial.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and cost.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure reliability and performance under harsh operating conditions, meeting military standards for quality and durability.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with common power sources, simplifying integration into existing systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments without compromising performance.

Technology: TTL

TTL technology offers high speed and low power consumption, making this product suitable for applications requiring fast and efficient digital arithmetic processing.

Technical Specifications

Digital Arithmetic Circuits SNJ54LS683W attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54LS683W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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