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SN74ALS521FN-00

Texas Instruments

SN74ALS521FN-00 by Texas Instruments

SN74ALS521FN-00 by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 20ns. It is used in commercial applications, operates b/w 0 to 70°C, and has inverted output polarity. This chip carrier package has a square shape, measures 8.9662mm in length and width, and supports surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,206 parts In-Stock

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Digiode

USA . 2,111 parts In-Stock

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2,111

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,413 parts In-Stock

1+ parts

$10.126

100+ parts

-

1k+ parts

$10.671

10k+ parts

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1,413

$10.126

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$10.671

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DigiPath Technology Company

USA . 1,172 parts In-Stock

1+ parts

$11.149

100+ parts

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1,172

$11.149

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ChromeModa Solutions

Germany . 3,996 parts In-Stock

1+ parts

$11.377

100+ parts

$9.329

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3,996

$11.377

$9.329

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IDEA Electronic Components Group

UK . 2,290 parts In-Stock

1+ parts

$11.377

100+ parts

$10.808

1k+ parts

$10.239

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2,290

$11.377

$10.808

$10.239

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AZTECH Wire

Italy . 733 parts In-Stock

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$18.920

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733

$18.920

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One Stop Electronics

USA . 768 parts In-Stock

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$32.000

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768

$32.000

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Corphita

USA . 624 parts In-Stock

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624

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Overview

Experience unparalleled performance and reliability with the SN74ALS521FN-00 by Texas Instruments, a leading manufacturer in digital arithmetic circuits. This versatile product offers 8 bits of precision in a convenient square package, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this chip carrier delivers exceptional speed and accuracy with minimal power consumption. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations every time. Elevate your designs with the SN74ALS521FN-00 and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and allows for efficient heat dissipation, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and making assembly more efficient.

No. of Bits: 8

With 8 bits, this digital arithmetic circuit can handle a wide range of calculations and operations, suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V ensures compatibility with standard power sources, making integration easy.

Propagation Delay (tpd): 20 ns

The low propagation delay ensures fast processing speed, making this circuit ideal for real-time applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this circuit can withstand high temperatures, enhancing its reliability in various environments.

Technology: TTL

Using TTL technology ensures compatibility with other TTL devices, making integration into existing systems seamless.

Technical Specifications

Digital Arithmetic Circuits SN74ALS521FN-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

ALS

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

SN74ALS521FN-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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