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SNJ54H183W

Texas Instruments

SNJ54H183W by Texas Instruments

SNJ54H183W by Texas Instruments is a TTL digital arithmetic circuit with 2 functions, operating at 5V supply voltage. With a propagation delay of 18ns, it is suitable for military-grade applications requiring fast calculations in the temperature range of -55 to 125°C. This rectangular flatpack package has 14 terminals and can handle a max power supply current of 69mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,395 parts In-Stock

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7,395

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Digiode

USA . 4,298 parts In-Stock

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4,298

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Distributors (Availability)

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AZTECH Wire

Italy . 810 parts In-Stock

1+ parts

$9.507

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810

$9.507

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Parana Technologies

USA . 803 parts In-Stock

1+ parts

$21.429

100+ parts

-

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$21.784

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803

$21.429

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$21.784

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DigiPath Technology Company

USA . 1,445 parts In-Stock

1+ parts

$23.596

100+ parts

$21.709

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1,445

$23.596

$21.709

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ChromeModa Solutions

Germany . 6,315 parts In-Stock

1+ parts

$24.078

100+ parts

$19.744

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6,315

$24.078

$19.744

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IDEA Electronic Components Group

UK . 1,510 parts In-Stock

1+ parts

$24.078

100+ parts

$22.874

1k+ parts

$21.670

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1,510

$24.078

$22.874

$21.670

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One Stop Electronics

USA . 1,092 parts In-Stock

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$38.000

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1,092

$38.000

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Corphita

USA . 137 parts In-Stock

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137

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Overview

Boost your digital arithmetic circuits with the SNJ54H183W by Texas Instruments. Crafted with quality ceramic and glass-sealed materials, this component offers reliability and durability like no other. Perfect for a wide range of applications, this product provides exceptional value and benefits to customers looking for superior performance and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability, making the product suitable for harsh environmental conditions.

Load Capacitance (CL): 25 pF

Low load capacitance allows for fast signal processing and high-speed operations.

Propagation Delay (tpd): 18 ns

Low propagation delay ensures efficient and quick data processing.

Maximum Operating Temperature: 125 °C

High operating temperature range makes the product suitable for various applications and environments.

Technology: TTL

TTL technology ensures reliable and CMOS-compatible logic operations.

Technical Specifications

Digital Arithmetic Circuits SNJ54H183W attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F14

Length:

8.725 mm

Load Capacitance (CL):

25 pF

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

69 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.35 mm

Trade Compliance

SNJ54H183W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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