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SN74F519D3

Texas Instruments

SN74F519D3 by Texas Instruments

SN74F519D3 by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals, operating at 5V. It comes in a small outline package and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring precise arithmetic calculations in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,369 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,369

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Digiode

USA . 1,228 parts In-Stock

1+ parts

-

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1,228

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,120 parts In-Stock

1+ parts

$2.269

100+ parts

-

1k+ parts

$2.178

10k+ parts

$2.178

3,120

$2.269

-

$2.178

$2.178

Parana Technologies

USA . 1,910 parts In-Stock

1+ parts

$8.973

100+ parts

-

1k+ parts

$9.643

10k+ parts

-

1,910

$8.973

-

$9.643

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DigiPath Technology Company

USA . 74 parts In-Stock

1+ parts

$9.880

100+ parts

$9.090

1k+ parts

-

10k+ parts

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74

$9.880

$9.090

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ChromeModa Solutions

Germany . 3,430 parts In-Stock

1+ parts

$10.082

100+ parts

$8.267

1k+ parts

-

10k+ parts

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3,430

$10.082

$8.267

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IDEA Electronic Components Group

UK . 712 parts In-Stock

1+ parts

$10.082

100+ parts

$9.578

1k+ parts

$9.074

10k+ parts

-

712

$10.082

$9.578

$9.074

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AZTECH Wire

Italy . 469 parts In-Stock

1+ parts

$15.346

100+ parts

-

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469

$15.346

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One Stop Electronics

USA . 534 parts In-Stock

1+ parts

$24.000

100+ parts

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534

$24.000

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Corphita

USA . 1,137 parts In-Stock

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1,137

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Overview

Experience unparalleled performance and reliability with the SN74F519D3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Arithmetic Circuits that are perfect for a wide range of applications. With its advanced technology and superior design, this product offers unmatched value and benefits to customers looking for a reliable solution. Trust Texas Instruments to provide you with the tools you need to succeed in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the digital arithmetic circuits.

Surface Mount: YES

Being surface mountable allows for easy installation and integration onto circuit boards, saving space and streamlining the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with various systems and power sources, making it versatile for different applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, these circuits can function reliably in various environments without overheating.

Technology: TTL

The use of TTL (transistor-transistor logic) technology ensures fast and reliable signal processing, making these circuits ideal for arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SN74F519D3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74F519D3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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