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SN74LS181N1

Texas Instruments

SN74LS181N1 by Texas Instruments

SN74LS181N1 by Texas Instruments is a TTL digital arithmetic circuit with 24 terminals and a supply voltage of 5V. It operates in commercial temperature range from 0°C to 70°C, making it suitable for various applications requiring precise calculations and logic operations. The package style is in-line rectangular shape made of plastic/epoxy material, ideal for through-hole mounting at a terminal pitch of 2.54mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,169 parts In-Stock

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5,169

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Digiode

USA . 4,270 parts In-Stock

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4,270

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 317 parts In-Stock

1+ parts

$7.186

100+ parts

-

1k+ parts

$6.899

10k+ parts

$6.899

317

$7.186

-

$6.899

$6.899

AZTECH Wire

Italy . 452 parts In-Stock

1+ parts

$11.218

100+ parts

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452

$11.218

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Parana Technologies

USA . 1,025 parts In-Stock

1+ parts

$17.374

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-

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$17.580

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1,025

$17.374

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$17.580

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DigiPath Technology Company

USA . 1,988 parts In-Stock

1+ parts

$19.131

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1,988

$19.131

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ChromeModa Solutions

Germany . 4,341 parts In-Stock

1+ parts

$19.521

100+ parts

$16.007

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4,341

$19.521

$16.007

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

1+ parts

$19.521

100+ parts

$18.545

1k+ parts

$17.569

10k+ parts

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1,217

$19.521

$18.545

$17.569

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One Stop Electronics

USA . 1,293 parts In-Stock

1+ parts

$39.000

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1,293

$39.000

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Corphita

USA . 2,585 parts In-Stock

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2,585

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Overview

Enhance your digital arithmetic circuits with the high-quality SN74LS181N1 from Texas Instruments. Designed for optimal performance and reliability, this product offers unmatched precision in a wide range of applications. With a focus on value and innovation, Texas Instruments delivers cutting-edge technology to meet all your needs. Trust in the reliability and efficiency of the SN74LS181N1 for seamless integration into your projects, providing exceptional results every time. Elevate your digital design with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and cost-effective, making the product easy to handle and affordable.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of digital systems and power supplies.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can perform reliably in various environmental conditions without overheating.

Technology: TTL

Using TTL technology ensures high-speed operation and compatibility with other TTL devices, making it suitable for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits SN74LS181N1 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS181N1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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