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SN74F382DWR

Texas Instruments

SN74F382DWR by Texas Instruments

SN74F382DWR by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 11 ns. It operates at a supply voltage range of 4.5V to 5.5V and has a max power supply current of 81mA. This small outline package is ideal for commercial applications requiring fast arithmetic calculations in TTL technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,549 parts In-Stock

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8,549

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Digiode

USA . 1,422 parts In-Stock

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1,422

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Distributors (Availability)

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Andel Nordic

Denmark . 2,540 parts In-Stock

1+ parts

$10.017

100+ parts

-

1k+ parts

$9.616

10k+ parts

$9.616

2,540

$10.017

-

$9.616

$9.616

AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$13.574

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873

$13.574

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Parana Technologies

USA . 558 parts In-Stock

1+ parts

$14.256

100+ parts

-

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$14.708

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558

$14.256

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$14.708

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DigiPath Technology Company

USA . 1,605 parts In-Stock

1+ parts

$15.698

100+ parts

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1,605

$15.698

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ChromeModa Solutions

Germany . 2,032 parts In-Stock

1+ parts

$16.018

100+ parts

$13.135

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2,032

$16.018

$13.135

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IDEA Electronic Components Group

UK . 190 parts In-Stock

1+ parts

$16.018

100+ parts

$15.217

1k+ parts

$14.416

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190

$16.018

$15.217

$14.416

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One Stop Electronics

USA . 142 parts In-Stock

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$18.000

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142

$18.000

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Corphita

USA . 1,489 parts In-Stock

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1,489

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Overview

Enhance your digital arithmetic circuits with the SN74F382DWR from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact rectangular package. This versatile 4-bit circuit offers customers fast propagation delay, a wide operating temperature range, and low power consumption. Ideal for a variety of applications, this small outline component is perfect for designers looking to optimize performance and efficiency. Upgrade your projects today with the SN74F382DWR and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting.

No. of Bits: 4

Suitable for applications requiring a small number of bits for arithmetic calculations, reducing complexity and cost.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common supply voltages, ensuring easy integration into existing systems.

Propagation Delay (tpd): 11 ns

Offers fast processing speed, making it efficient for time-sensitive operations.

Technology: TTL

TTL technology provides high-speed operation and reliability, ideal for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits SN74F382DWR attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY LOOKAHEAD

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

81 mA

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN74F382DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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