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SNJ54HC677FK-00

Texas Instruments

SNJ54HC677FK-00 by Texas Instruments

SNJ54HC677FK-00 by Texas Instruments is a 16-bit digital arithmetic circuit with CMOS technology. It operates b/w -55 to 125 °C and has a propagation delay of 187 ns. Suitable for military applications, it features inverted output polarity and comes in a square chip carrier package.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 4,663 parts In-Stock

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Digiode

USA . 2,376 parts In-Stock

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Andel Nordic

Denmark . 1,226 parts In-Stock

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$3.448

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$3.310

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$3.310

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$3.448

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$3.310

Parana Technologies

USA . 658 parts In-Stock

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$13.353

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$13.865

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658

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DigiPath Technology Company

USA . 1,261 parts In-Stock

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$14.703

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ChromeModa Solutions

Germany . 5,770 parts In-Stock

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$15.003

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$12.302

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$15.003

$12.302

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IDEA Electronic Components Group

UK . 113 parts In-Stock

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$15.003

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$14.253

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$13.503

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113

$15.003

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$13.503

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AZTECH Wire

Italy . 798 parts In-Stock

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$18.319

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One Stop Electronics

USA . 1,422 parts In-Stock

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$36.000

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Corphita

USA . 3,655 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the SNJ54HC677FK-00 by Texas Instruments. Crafted with precision and excellence, this chip carrier package offers unmatched quality and reliability. Ideal for military-grade applications, this square-shaped device delivers 16 bits of power with inverted output polarity and a fast propagation delay of 187 ns. Experience seamless performance at temperatures ranging from -55°C to 125°C, making it versatile for various environments. Trust in Texas Instruments to provide top-tier technology that exceeds expectations. Choose the SNJ54HC677FK-00 for unparalleled value and efficiency in your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body materials ensures durability and reliability in various operating conditions.

No. of Bits: 16

Offers a high level of precision and accuracy in digital arithmetic calculations due to the 16-bit architecture.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level of 5V, making it compatible with a wide range of systems and applications.

Propagation Delay (tpd): 187 ns

Provides fast signal processing with a low propagation delay of 187 nanoseconds.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed performance.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments up to 125°C, suitable for demanding industrial applications.

Technical Specifications

Digital Arithmetic Circuits SNJ54HC677FK-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH INHIBIT

Family:

HC/UH

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

16

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

187 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

SNJ54HC677FK-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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