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SNC54ALS633JD

Texas Instruments

SNC54ALS633JD by Texas Instruments

SNC54ALS633JD by Texas Instruments is a MIL-STD-883 Class B (Modified) rated digital arithmetic circuit with 52 terminals. Operating temperature ranges from -55°C to 125°C, suitable for military applications. Utilizes TTL technology in a ceramic package with through-hole terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,501 parts In-Stock

1+ parts

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4,501

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Vyrian

USA . 2,366 parts In-Stock

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2,366

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,509 parts In-Stock

1+ parts

$7.886

100+ parts

-

1k+ parts

$7.570

10k+ parts

$7.570

3,509

$7.886

-

$7.570

$7.570

Parana Technologies

USA . 964 parts In-Stock

1+ parts

$7.959

100+ parts

-

1k+ parts

$8.531

10k+ parts

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964

$7.959

-

$8.531

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DigiPath Technology Company

USA . 841 parts In-Stock

1+ parts

$8.764

100+ parts

$8.063

1k+ parts

-

10k+ parts

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841

$8.764

$8.063

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ChromeModa Solutions

Germany . 5,119 parts In-Stock

1+ parts

$8.943

100+ parts

$7.333

1k+ parts

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5,119

$8.943

$7.333

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IDEA Electronic Components Group

UK . 1,000 parts In-Stock

1+ parts

$8.943

100+ parts

$8.496

1k+ parts

$8.049

10k+ parts

-

1,000

$8.943

$8.496

$8.049

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AZTECH Wire

Italy . 220 parts In-Stock

1+ parts

$10.236

100+ parts

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220

$10.236

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One Stop Electronics

USA . 789 parts In-Stock

1+ parts

$47.000

100+ parts

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789

$47.000

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Corphita

USA . 2,957 parts In-Stock

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2,957

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Overview

Elevate your digital arithmetic circuits with the SNC54ALS633JD by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in every product they create. This military-grade device offers unmatched performance, making it ideal for a wide range of applications. From aerospace to telecommunications, this TTL technology ensures precision and efficiency in all your projects. Trust Texas Instruments to provide value and innovation with the SNC54ALS633JD.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and mechanical strength, making the product durable and reliable for high-temperature applications.

Screening Level: MIL-STD-883 Class B (Modified)

MIL-STD-883 Class B screening ensures high quality and reliability, making the product suitable for military and aerospace applications where strict standards are required.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without compromising performance.

Terminal Position: DUAL

Dual terminal position allows for better connectivity and stability in the circuit, leading to improved overall performance and reliability.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making the product ideal for high-speed digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits SNC54ALS633JD attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T52

No. of Terminals:

52

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP52,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54ALS633JD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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