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SN54S283J-00

Texas Instruments

SN54S283J-00 by Texas Instruments

SN54S283J-00 by Texas Instruments is a 4-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 18ns. It operates in military-grade temperatures from -55 to 125°C, making it suitable for high-reliability applications. The package style is in-line with through-hole terminals, ideal for robust electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,596 parts In-Stock

1+ parts

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8,596

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Digiode

USA . 1,979 parts In-Stock

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1,979

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,362 parts In-Stock

1+ parts

$4.044

100+ parts

-

1k+ parts

$3.882

10k+ parts

$3.882

3,362

$4.044

-

$3.882

$3.882

One Stop Electronics

USA . 195 parts In-Stock

1+ parts

$12.000

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-

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195

$12.000

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AZTECH Wire

Italy . 193 parts In-Stock

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$17.522

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193

$17.522

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Parana Technologies

USA . 81 parts In-Stock

1+ parts

$29.120

100+ parts

-

1k+ parts

$55.645

10k+ parts

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81

$29.120

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$55.645

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DigiPath Technology Company

USA . 894 parts In-Stock

1+ parts

$32.065

100+ parts

$29.499

1k+ parts

-

10k+ parts

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894

$32.065

$29.499

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ChromeModa Solutions

Germany . 4,466 parts In-Stock

1+ parts

$32.719

100+ parts

$26.830

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4,466

$32.719

$26.830

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IDEA Electronic Components Group

UK . 2,000 parts In-Stock

1+ parts

$32.719

100+ parts

$31.083

1k+ parts

$29.447

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2,000

$32.719

$31.083

$29.447

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Corphita

USA . 1,052 parts In-Stock

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1,052

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Overview

Unlock the power of precision and reliability with the Texas Instruments SN54S283J-00. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital arithmetic circuits that are essential for a wide range of applications. With a focus on innovation and cutting-edge technology, this product offers unmatched value, efficiency, and performance. Experience seamless operations and enhanced functionality with the SN54S283J-00, the perfect solution for your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protects the internal circuitry, ensuring reliable performance.

No. of Bits: 4

Ideal for applications requiring calculations with 4-bit precision.

Nomial Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply, making it easy to integrate into existing systems.

Propagation Delay (tpd): 18 ns

Low propagation delay allows for fast and efficient processing of arithmetic operations.

Temperature Grade: MILITARY

Suitable for rugged environments and military applications, where reliability under extreme conditions is crucial.

Technology: TTL

Uses TTL technology, known for its high-speed operation and low power consumption.

Technical Specifications

Digital Arithmetic Circuits SN54S283J-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER

Family:

S

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

160 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN54S283J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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