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SNJ54HC881FK

Texas Instruments

SNJ54HC881FK by Texas Instruments

SNJ54HC881FK by Texas Instruments is a CMOS digital arithmetic circuit in a ceramic chip carrier package. With 28 terminals and operating temperatures ranging from -55°C to 125°C, it is ideal for military-grade applications requiring high-performance computing capabilities. This surface-mountable device with quad terminal position offers reliability and efficiency in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,431 parts In-Stock

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5,431

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Digiode

USA . 376 parts In-Stock

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376

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Distributors (Availability)

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Andel Nordic

Denmark . 118 parts In-Stock

1+ parts

$6.971

100+ parts

-

1k+ parts

$6.692

10k+ parts

$6.692

118

$6.971

-

$6.692

$6.692

AZTECH Wire

Italy . 610 parts In-Stock

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$10.158

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610

$10.158

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Parana Technologies

USA . 650 parts In-Stock

1+ parts

$23.475

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$24.106

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650

$23.475

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$24.106

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DigiPath Technology Company

USA . 1,839 parts In-Stock

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$25.848

100+ parts

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1,839

$25.848

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ChromeModa Solutions

Germany . 1,725 parts In-Stock

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$26.376

100+ parts

$21.628

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1,725

$26.376

$21.628

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IDEA Electronic Components Group

UK . 1,249 parts In-Stock

1+ parts

$26.376

100+ parts

$25.057

1k+ parts

$23.738

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1,249

$26.376

$25.057

$23.738

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One Stop Electronics

USA . 761 parts In-Stock

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$41.000

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761

$41.000

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Corphita

USA . 1,571 parts In-Stock

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1,571

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Overview

Enhance your digital arithmetic circuits with the SNJ54HC881FK by Texas Instruments, a high-quality product that delivers exceptional performance and reliability. Manufactured by a trusted industry leader, this chip carrier package offers military-grade temperature tolerance, making it ideal for a wide range of applications. Experience the value of seamless integration, improved efficiency, and enhanced functionality with this innovative solution. Upgrade your electronic devices today with the SNJ54HC881FK and unlock endless possibilities in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal conductivity and insulation, making it suitable for high temperature and high performance applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space.

Screening Level: 38535Q/M;38534H;883B

These screening levels ensure high quality and reliability, meeting military standards for performance and durability.

Package Shape: SQUARE

Square package shape makes it easy to mount and align on PCBs, improving overall circuit assembly.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature makes this product suitable for operation in cold environments without compromising performance.

Temperature Grade: MILITARY

Military grade temperature specifications ensure reliability and performance in extreme conditions, making it ideal for critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, reducing environmental impact.

Terminal Pitch: 1.27 mm

With a standard terminal pitch, it is compatible with commonly used PCB layouts, making it easy to integrate into existing designs.

Technical Specifications

Digital Arithmetic Circuits SNJ54HC881FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N28

Logic IC Type:

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNJ54HC881FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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