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SN74S485AJ

Texas Instruments

SN74S485AJ by Texas Instruments

SN74S485AJ by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals in an in-line rectangular ceramic package. It operates b/w 0°C to 70°C, drawing a max current of 100mA. Ideal for commercial applications requiring dual terminal positions and through-hole technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,279 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,279

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Digiode

USA . 1,900 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 203 parts In-Stock

1+ parts

$5.148

100+ parts

-

1k+ parts

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10k+ parts

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203

$5.148

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Andel Nordic

Denmark . 3,665 parts In-Stock

1+ parts

$7.164

100+ parts

-

1k+ parts

$6.878

10k+ parts

$6.878

3,665

$7.164

-

$6.878

$6.878

Parana Technologies

USA . 2,025 parts In-Stock

1+ parts

$8.650

100+ parts

-

1k+ parts

$9.321

10k+ parts

-

2,025

$8.650

-

$9.321

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DigiPath Technology Company

USA . 1,666 parts In-Stock

1+ parts

$9.525

100+ parts

$8.763

1k+ parts

-

10k+ parts

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1,666

$9.525

$8.763

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ChromeModa Solutions

Germany . 3,522 parts In-Stock

1+ parts

$9.719

100+ parts

$7.970

1k+ parts

-

10k+ parts

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3,522

$9.719

$7.970

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IDEA Electronic Components Group

UK . 2,012 parts In-Stock

1+ parts

$9.719

100+ parts

$9.233

1k+ parts

$8.747

10k+ parts

-

2,012

$9.719

$9.233

$8.747

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One Stop Electronics

USA . 1,373 parts In-Stock

1+ parts

$14.000

100+ parts

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1k+ parts

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10k+ parts

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1,373

$14.000

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Corphita

USA . 267 parts In-Stock

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267

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Overview

Unlock the power of digital arithmetic circuits with the SN74S485AJ by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this product offers exceptional value to customers seeking high-performance solutions. Experience the benefits of cutting-edge technology in a compact package, ensuring seamless integration and maximum efficiency. Upgrade your projects with the SN74S485AJ and discover the difference TI can make in your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its durability and resistance to high temperatures, making it a reliable choice for electronic components.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and assembly within electronic circuit designs.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting to other components and peripherals in the circuit.

Package Style (Meter): IN-LINE

The in-line package style is user-friendly and allows for easier installation and troubleshooting.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can function effectively in a variety of environments without overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliability and performance even in cooler conditions.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in connection options, improving reliability in the circuit.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range ensures compatibility with standard operating conditions in various applications.

Technology: TTL

TTL technology provides high-speed and reliable signal processing, making it suitable for various digital arithmetic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals are secure and stable for soldering, ensuring a robust connection in the circuit.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for compatibility with common PCB layouts and components, facilitating integration.

Maximum Power Supply Current (ICC): 100 mA

A maximum power supply current of 100 mA ensures that the circuit operates within safe and efficient power limits.

Technical Specifications

Digital Arithmetic Circuits SN74S485AJ attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

100 mA

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74S485AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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