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SN74AS264NP3

Texas Instruments

SN74AS264NP3 by Texas Instruments

SN74AS264NP3 by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring precise calculations and logic operations. The through-hole terminal form and 2.54mm pitch enhance its reliability in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,540 parts In-Stock

1+ parts

-

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3,540

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Vyrian

USA . 3,485 parts In-Stock

1+ parts

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3,485

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,805 parts In-Stock

1+ parts

$7.940

100+ parts

-

1k+ parts

$7.622

10k+ parts

$7.622

2,805

$7.940

-

$7.622

$7.622

Parana Technologies

USA . 968 parts In-Stock

1+ parts

$10.599

100+ parts

-

1k+ parts

$11.099

10k+ parts

-

968

$10.599

-

$11.099

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DigiPath Technology Company

USA . 1,877 parts In-Stock

1+ parts

$11.671

100+ parts

-

1k+ parts

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1,877

$11.671

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ChromeModa Solutions

Germany . 2,134 parts In-Stock

1+ parts

$11.909

100+ parts

$9.765

1k+ parts

-

10k+ parts

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2,134

$11.909

$9.765

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IDEA Electronic Components Group

UK . 1 parts In-Stock

1+ parts

$11.909

100+ parts

$11.314

1k+ parts

$10.718

10k+ parts

-

1

$11.909

$11.314

$10.718

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AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$18.648

100+ parts

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472

$18.648

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One Stop Electronics

USA . 450 parts In-Stock

1+ parts

$29.000

100+ parts

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450

$29.000

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Corphita

USA . 218 parts In-Stock

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218

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Overview

Unlock your potential with the SN74AS264NP3 by Texas Instruments, a leading manufacturer known for top-quality digital arithmetic circuits. This versatile product offers seamless integration and reliability in various applications, providing customers with unmatched value and benefits. Whether you're designing cutting-edge electronics or upgrading existing systems, this innovative solution guarantees superior performance and efficiency. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement in circuit designs.

No. of Terminals: 16

Having 16 terminals provides flexibility in connections and allows for more complex circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to connect the circuit to other components in a linear fashion, simplifying the overall design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand prolonged use without overheating, increasing its reliability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature means the product can function effectively even in cooler environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position allows for more secure connections and reduces the risk of signal interference, improving overall performance.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial applications, ensuring compatibility with commonly used components.

Technology: TTL

The TTL technology offers fast and reliable digital signal processing, making the product ideal for high-speed arithmetic calculations.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a sturdy connection to the circuit board, reducing the risk of signal loss or disconnection during operation.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy soldering and connection to standard size components, enhancing the product's versatility.

Technical Specifications

Digital Arithmetic Circuits SN74AS264NP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS264NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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