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SN74ALS635JDP4

Texas Instruments

SN74ALS635JDP4 by Texas Instruments

SN74ALS635JDP4 by Texas Instruments is a 48-terminal digital arithmetic circuit with TTL technology. It operates b/w 0°C to 70°C, making it suitable for commercial applications. The package is rectangular in shape and made of ceramic, with an in-line style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,196 parts In-Stock

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Digiode

USA . 2,757 parts In-Stock

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2,757

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Distributors (Availability)

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AZTECH Wire

Italy . 766 parts In-Stock

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$11.210

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766

$11.210

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Parana Technologies

USA . 2,215 parts In-Stock

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$12.888

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$13.370

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2,215

$12.888

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$13.370

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DigiPath Technology Company

USA . 1,755 parts In-Stock

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$14.191

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1,755

$14.191

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ChromeModa Solutions

Germany . 3,596 parts In-Stock

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$14.481

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$11.874

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3,596

$14.481

$11.874

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IDEA Electronic Components Group

UK . 1,021 parts In-Stock

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$14.481

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$13.757

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$13.033

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1,021

$14.481

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$13.033

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One Stop Electronics

USA . 1,343 parts In-Stock

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$25.000

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1,343

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Corphita

USA . 291 parts In-Stock

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291

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Overview

Enhance your digital arithmetic circuits with the SN74ALS635JDP4 from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in a ceramic rectangular package with 48 terminals. Ideal for commercial applications, this TTL technology product operates smoothly in temperatures ranging from 0 to 70°C. Upgrade your systems with the superior performance and value that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic offers excellent heat resistance and durability, making it ideal for high temperature applications.

Package Shape: RECTANGULAR

Rectangular shape can provide better space utilization and easier integration into circuit designs.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and versatility in circuit connections.

Package Style (Meter): IN-LINE

The in-line package style is commonly used and easily mountable on circuit boards, simplifying the assembly process.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand higher temperature environments without performance issues.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliability and functionality in various environmental conditions.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in circuit connections, enhancing overall reliability.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product is suitable for use in typical commercial settings with consistent performance.

Technology: TTL

TTL technology offers high-speed operation and reliable digital signal processing, making it a popular choice in various digital circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure connections and ease of soldering during circuit board assembly.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm allows for easy compatibility with common circuit board layouts and components.

Technical Specifications

Digital Arithmetic Circuits SN74ALS635JDP4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS635JDP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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