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SN74LS688FN3

Texas Instruments

SN74LS688FN3 by Texas Instruments

SN74LS688FN3 by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals in a square chip carrier package. Operating at 5V, it has a temperature range of 0-70°C and is suitable for commercial applications requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,316 parts In-Stock

1+ parts

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7,316

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Digiode

USA . 2,381 parts In-Stock

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2,381

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,446 parts In-Stock

1+ parts

$5.160

100+ parts

-

1k+ parts

$4.953

10k+ parts

$4.953

3,446

$5.160

-

$4.953

$4.953

Parana Technologies

USA . 2,198 parts In-Stock

1+ parts

$11.610

100+ parts

-

1k+ parts

$12.008

10k+ parts

-

2,198

$11.610

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$12.008

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AZTECH Wire

Italy . 241 parts In-Stock

1+ parts

$12.646

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241

$12.646

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DigiPath Technology Company

USA . 1,808 parts In-Stock

1+ parts

$12.784

100+ parts

$11.761

1k+ parts

-

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1,808

$12.784

$11.761

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IDEA Electronic Components Group

UK . 2,029 parts In-Stock

1+ parts

$13.045

100+ parts

$12.393

1k+ parts

$11.740

10k+ parts

-

2,029

$13.045

$12.393

$11.740

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ChromeModa Solutions

Germany . 433 parts In-Stock

1+ parts

$13.045

100+ parts

$10.697

1k+ parts

-

10k+ parts

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433

$13.045

$10.697

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One Stop Electronics

USA . 1,141 parts In-Stock

1+ parts

$37.000

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1,141

$37.000

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Corphita

USA . 1,702 parts In-Stock

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1,702

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Overview

Upgrade your digital arithmetic circuits with the SN74LS688FN3 from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a range of applications. With a focus on performance and efficiency, this chip carrier package offers customers a cost-effective solution with a nominal supply voltage of 5V. Perfect for commercial use, this versatile component is designed to excel in various scenarios, ensuring seamless operation and optimal results. Experience the benefits of top-notch technology with the SN74LS688FN3 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology provides efficient PCB assembly and allows for higher component density, leading to compact and space-saving designs.

Package Shape: SQUARE

Square package shape offers easy handling and efficient use of board space, contributing to a neat and organized circuit layout.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with common power sources and simplifies integration into existing systems.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and enables the product to interface with multiple components seamlessly.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the product can withstand demanding environmental conditions and ensure reliable performance over an extended period.

Technology: TTL

Utilizing TTL technology offers high-speed operation and low power consumption, making the product suitable for applications requiring rapid calculations and energy efficiency.

Technical Specifications

Digital Arithmetic Circuits SN74LS688FN3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74LS688FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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