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SN54H183J

Texas Instruments

SN54H183J by Texas Instruments

SN54H183J by Texas Instruments is a digital arithmetic circuit with 2 functions, operating at 5V. It has a propagation delay of 18ns and can withstand temperatures from -55 to 125°C. Ideal for military-grade applications requiring fast calculations in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,574 parts In-Stock

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Digiode

USA . 2,147 parts In-Stock

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2,147

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LWI Electronics Inc

India . 114 parts In-Stock

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Electronic Expediters

USA . 19 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 2,861 parts In-Stock

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$4.905

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$4.708

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$4.708

2,861

$4.905

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$4.708

$4.708

Parana Technologies

USA . 1,021 parts In-Stock

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$8.831

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$9.516

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1,021

$8.831

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$9.516

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DigiPath Technology Company

USA . 1,361 parts In-Stock

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$9.724

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1,361

$9.724

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ChromeModa Solutions

Germany . 3,262 parts In-Stock

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$9.922

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$8.136

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3,262

$9.922

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IDEA Electronic Components Group

UK . 1,945 parts In-Stock

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$9.922

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$9.426

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$8.930

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1,945

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$8.930

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AZTECH Wire

Italy . 796 parts In-Stock

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$19.483

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One Stop Electronics

USA . 188 parts In-Stock

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$26.000

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Corphita

USA . 316 parts In-Stock

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Overview

Looking for top-quality digital arithmetic circuits? Look no further than the SN54H183J by Texas Instruments. With a reputation for excellence, Texas Instruments delivers reliable and durable products that meet the highest industry standards. Whether you're working on industrial automation, telecommunications, or computer applications, this versatile component offers unmatched performance and efficiency. Trust Texas Instruments to provide cutting-edge technology that ensures seamless operation and optimal results. Choose the SN54H183J for all your digital arithmetic circuit needs and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and protection for the internal components, making the product suitable for a variety of environments.

No. of Functions: 2

Having multiple functions in one package reduces the need for additional components, making the product more compact and efficient.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with common power sources and devices.

Propagation Delay (tpd): 18 ns

Low propagation delay allows for quick response times, making the product suitable for high-speed applications.

Temperature Grade: MILITARY

The military-grade temperature range ensures reliability and performance in harsh conditions, making the product ideal for demanding environments.

Technical Specifications

Digital Arithmetic Circuits SN54H183J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

25 pF

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

69 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN54H183J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-162-4454, 5962001624454

NIIN

001624454

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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