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SN74HC280N3

Texas Instruments

SN74HC280N3 by Texas Instruments

SN74HC280N3 by Texas Instruments is a CMOS digital arithmetic circuit with 14 terminals. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies of 2/6V, it features a rectangular package shape made of plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,811 parts In-Stock

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2,811

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Digiode

USA . 1,738 parts In-Stock

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1,738

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Distributors (Availability)

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Andel Nordic

Denmark . 2,347 parts In-Stock

1+ parts

$2.488

100+ parts

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1k+ parts

$2.389

10k+ parts

$2.389

2,347

$2.488

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$2.389

$2.389

AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$7.576

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786

$7.576

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One Stop Electronics

USA . 986 parts In-Stock

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$8.000

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986

$8.000

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Parana Technologies

USA . 1,391 parts In-Stock

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$19.486

100+ parts

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$19.492

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1,391

$19.486

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$19.492

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DigiPath Technology Company

USA . 2,372 parts In-Stock

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$21.456

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2,372

$21.456

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IDEA Electronic Components Group

UK . 1,515 parts In-Stock

1+ parts

$21.894

100+ parts

$20.799

1k+ parts

$19.705

10k+ parts

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1,515

$21.894

$20.799

$19.705

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ChromeModa Solutions

Germany . 1,257 parts In-Stock

1+ parts

$21.894

100+ parts

$17.953

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1,257

$21.894

$17.953

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Corphita

USA . 1,116 parts In-Stock

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1,116

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Overview

The SN74HC280N3 by Texas Instruments is a top-of-the-line digital arithmetic circuit offering unmatched quality and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product ensures superior performance in a variety of applications. From industrial automation to consumer electronics, the SN74HC280N3 excels in providing efficient and accurate arithmetic operations. Its durable plastic/epoxy package and wide temperature range make it ideal for demanding environments. Experience the value and benefits of Texas Instruments' expertise with the SN74HC280N3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a commonly used material for electronic components due to its durability and resistance to heat, making this product reliable for long-term use.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easier integration into circuit designs and can help optimize space efficiency in a layout.

Power Supplies (V): 2/6

The wide range of power supply voltage options (2V to 6V) provides flexibility in various applications and allows for compatibility with different power sources.

No. of Terminals: 14

Having 14 terminals allows for multiple connection points, enabling more complex circuit configurations for enhanced functionality.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to install and connect the device within a circuit, reducing assembly time and simplifying maintenance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures without compromising performance, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extreme cold environments, enhancing the product's versatility.

Terminal Position: DUAL

Having dual terminal positions provides redundancy and improves electrical connectivity, reducing the risk of signal loss or circuit interruptions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product is designed to withstand harsh environmental conditions commonly found in industrial settings, ensuring long-term reliability.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure mechanical support and easy soldering during assembly, ensuring stable connections and reducing the risk of electrical failures.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy interfacing with standard PCB layouts and components, simplifying the integration process and facilitating compatibility with existing designs.

Technical Specifications

Digital Arithmetic Circuits SN74HC280N3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC280N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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