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SN74HC882NT3

Texas Instruments

SN74HC882NT3 by Texas Instruments

Texas Instruments SN74HC882NT3 is a CMOS digital arithmetic circuit with 24 terminals. It operates in industrial temperature range (-40 to 85°C) and has a rectangular package style. Ideal for applications requiring precise calculations in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,683 parts In-Stock

1+ parts

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5,683

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Digiode

USA . 1,473 parts In-Stock

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1,473

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,512 parts In-Stock

1+ parts

$3.647

100+ parts

-

1k+ parts

$3.501

10k+ parts

$3.501

4,512

$3.647

-

$3.501

$3.501

One Stop Electronics

USA . 472 parts In-Stock

1+ parts

$5.000

100+ parts

-

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472

$5.000

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AZTECH Wire

Italy . 755 parts In-Stock

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$9.580

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755

$9.580

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Parana Technologies

USA . 820 parts In-Stock

1+ parts

$13.743

100+ parts

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$14.231

10k+ parts

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820

$13.743

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$14.231

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DigiPath Technology Company

USA . 1,272 parts In-Stock

1+ parts

$15.133

100+ parts

$13.923

1k+ parts

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1,272

$15.133

$13.923

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ChromeModa Solutions

Germany . 3,911 parts In-Stock

1+ parts

$15.442

100+ parts

$12.662

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3,911

$15.442

$12.662

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IDEA Electronic Components Group

UK . 2,145 parts In-Stock

1+ parts

$15.442

100+ parts

$14.670

1k+ parts

$13.898

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2,145

$15.442

$14.670

$13.898

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Corphita

USA . 2,595 parts In-Stock

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2,595

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Overview

Unlock the power of digital arithmetic circuits with the SN74HC882NT3 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a wide range of applications. The SN74HC882NT3 offers customers value and benefits with its industrial temperature grade, durable plastic/epoxy package body material, and 24 terminals for seamless integration. Experience the advantages of CMOS technology and dual terminal position for efficient performance in your next project. Elevate your designs with the SN74HC882NT3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or industrial applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy integration into various electronic devices.

No. of Terminals: 24

Having a higher number of terminals allows for more connectivity options and flexibility in circuit design.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to connect the device in a linear fashion, simplifying installation and maintenance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without failure.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function reliably in extremely cold environments.

Terminal Position: DUAL

The dual terminal position allows for redundancy in connections, enhancing the product's reliability.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate in a wide range of temperatures, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides strong mechanical connections, reducing the risk of failure due to vibration or stress.

Terminal Pitch: 2.54 mm

The standard 2.54mm terminal pitch allows for easy assembly and compatibility with common electronic components, simplifying design and manufacturing processes.

Technical Specifications

Digital Arithmetic Circuits SN74HC882NT3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC882NT3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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