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SN74185J

Texas Instruments

SN74185J by Texas Instruments

SN74185J by Texas Instruments is a 5-bit digital arithmetic circuit with a 40 ns propagation delay. It operates at a nominal voltage of 5V and has open-collector output characteristics. This TTL technology chip is commonly used in commercial applications requiring fast arithmetic operations within the temperature range of 0 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,529 parts In-Stock

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Digiode

USA . 2,665 parts In-Stock

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2,665

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Andel Nordic

Denmark . 1,604 parts In-Stock

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$5.919

100+ parts

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$5.682

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$5.682

1,604

$5.919

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$5.682

$5.682

Parana Technologies

USA . 346 parts In-Stock

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$9.981

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$10.544

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346

$9.981

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$10.544

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DigiPath Technology Company

USA . 839 parts In-Stock

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$10.991

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839

$10.991

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ChromeModa Solutions

Germany . 5,207 parts In-Stock

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$11.215

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$9.196

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5,207

$11.215

$9.196

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IDEA Electronic Components Group

UK . 608 parts In-Stock

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$11.215

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$10.654

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$10.094

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608

$11.215

$10.654

$10.094

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AZTECH Wire

Italy . 483 parts In-Stock

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$17.141

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One Stop Electronics

USA . 979 parts In-Stock

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$31.000

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Corphita

USA . 2,558 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the SN74185J by Texas Instruments, a top-quality product from a renowned manufacturer. Designed with precision and reliability in mind, this rectangular package boasts 5 bits of power, making it ideal for a wide range of applications. Experience the benefits of fast propagation delay and open-collector output characteristics, all while enjoying the value and performance that Texas Instruments is known for. Upgrade your electronic projects with the SN74185J today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the circuit components, ensuring reliable performance in various operating conditions.

No. of Bits: 5

Offers a sufficient number of bits for processing digital data accurately and efficiently.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement, making it compatible with common power sources.

Propagation Delay (tpd): 40 ns

Fast propagation delay allows for quick processing of data, suitable for applications requiring high-speed performance.

Output Characteristics: OPEN-COLLECTOR

Open-collector output enables easy interfacing with other components or systems, enhancing flexibility in circuit design.

Technology: TTL

Utilizes TTL technology known for its reliability and compatibility with a wide range of devices, making it a popular choice in digital circuits.

Technical Specifications

Digital Arithmetic Circuits SN74185J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

BINARY TO BCD CONVERTER; 6 BIT CONVERSION WITH LSB BY-PASS; WITH INHIBIT

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

No. of Bits:

5

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

99 mA

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74185J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-359-7586, 5962003597586

NIIN

003597586

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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