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SNJ54HC682FK

Texas Instruments

SNJ54HC682FK by Texas Instruments

SNJ54HC682FK by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V. It features a propagation delay of 413ns and operates in temperatures ranging from -55°C to 125°C. This chip carrier package is ideal for military-grade applications requiring inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,647 parts In-Stock

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Digiode

USA . 978 parts In-Stock

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978

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Distributors (Availability)

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AZTECH Wire

Italy . 574 parts In-Stock

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$5.522

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574

$5.522

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Andel Nordic

Denmark . 5,996 parts In-Stock

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$7.958

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$7.640

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$7.640

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$7.958

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$7.640

Parana Technologies

USA . 698 parts In-Stock

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$29.669

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$61.854

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698

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One Stop Electronics

USA . 313 parts In-Stock

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$31.000

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313

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ChromeModa Solutions

Germany . 3,572 parts In-Stock

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$33.336

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$27.336

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$33.336

$27.336

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IDEA Electronic Components Group

UK . 323 parts In-Stock

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$33.336

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$31.669

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$30.002

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323

$33.336

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Corphita

USA . 4,018 parts In-Stock

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DigiPath Technology Company

USA . 2,195 parts In-Stock

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$30.056

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Overview

Discover the exceptional performance and reliability of the SNJ54HC682FK by Texas Instruments, a leading manufacturer known for producing top-quality digital arithmetic circuits. Designed with precision and expertise, this product offers unmatched value and benefits for a wide range of applications. Whether you're in need of fast and efficient data processing or precise calculations, this chip carrier package is the perfect solution. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the SNJ54HC682FK and experience the difference today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent durability and reliability, making this product a good choice for rugged environments.

No. of Bits: 8

The 8 bits offer sufficient precision and accuracy for digital arithmetic calculations, making this product suitable for various applications requiring complex computations.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V ensures compatibility with common power sources and makes integration into existing systems straightforward.

Propation Delay (tpd): 413 ns

With a propagation delay of 413 ns, this digital arithmetic circuit offers fast processing speeds, enabling efficient operation in time-critical applications.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, making it suitable for battery-powered devices and noise-sensitive environments.

Technical Specifications

Digital Arithmetic Circuits SNJ54HC682FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH PULL-UP RESISTORS ON B INPUTS; WITH A = B & A > B OUTPUTS

Family:

HC/UH

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Propagation Delay (tpd):

413 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54HC682FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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