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SNJ54HC679FK-00

Texas Instruments

SNJ54HC679FK-00 by Texas Instruments

SNJ54HC679FK-00 by Texas Instruments is a 12-bit digital arithmetic circuit with CMOS technology. It operates b/w -55°C to 125°C, with a propagation delay of 240ns and inverted output polarity. Suitable for military applications, it has a package style of chip carrier and terminal pitch of 1.27mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,509 parts In-Stock

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Digiode

USA . 4,576 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 261 parts In-Stock

1+ parts

$2.263

100+ parts

-

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$2.172

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$2.172

261

$2.263

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$2.172

$2.172

AZTECH Wire

Italy . 287 parts In-Stock

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$5.525

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$5.525

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One Stop Electronics

USA . 930 parts In-Stock

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$7.000

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930

$7.000

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Parana Technologies

USA . 740 parts In-Stock

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$8.841

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$821.045

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$7.957

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740

$8.841

$821.045

$7.957

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DigiPath Technology Company

USA . 580 parts In-Stock

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$9.735

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580

$9.735

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ChromeModa Solutions

Germany . 2,862 parts In-Stock

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$9.934

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$8.146

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2,862

$9.934

$8.146

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IDEA Electronic Components Group

UK . 1,651 parts In-Stock

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$9.934

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$9.437

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$8.941

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1,651

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Corphita

USA . 2,829 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the top-notch quality and reliability of the SNJ54HC679FK-00 by Texas Instruments. Designed with precision and innovation, this chip carrier package offers a seamless integration into your projects, allowing for efficient and accurate computations. Ideal for military-grade applications, this Texas Instruments product ensures optimal performance even in extreme temperatures. Trust in Texas Instruments to deliver exceptional value and cutting-edge technology with the SNJ54HC679FK-00, providing you with the competitive edge you need to succeed.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures high durability and resistance to harsh operating conditions.

No. of Bits: 12

The 12-bit design allows for more precise digital arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures reliable operation of the digital arithmetic circuits.

Propagation Delay (tpd): 240 ns

Low propagation delay of 240ns ensures fast processing of arithmetic operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Temperature Grade: MILITARY

Military-grade temperature range ensures the product can withstand extreme temperatures and harsh environments.

Technical Specifications

Digital Arithmetic Circuits SNJ54HC679FK-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH INHIBIT

Family:

HC/UH

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

12

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54HC679FK-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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