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SNJ54LS685FK

Texas Instruments

SNJ54LS685FK by Texas Instruments

SNJ54LS685FK by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 35ns. It features open-collector output characteristics, operates in a temperature range from -55 to 125°C, and is ideal for military-grade applications requiring TTL technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,940 parts In-Stock

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8,940

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Digiode

USA . 4,725 parts In-Stock

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4,725

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,255 parts In-Stock

1+ parts

$8.176

100+ parts

-

1k+ parts

$8.783

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2,255

$8.176

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$8.783

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ChromeModa Solutions

Germany . 3,716 parts In-Stock

1+ parts

$9.187

100+ parts

$7.533

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3,716

$9.187

$7.533

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IDEA Electronic Components Group

UK . 1,928 parts In-Stock

1+ parts

$9.187

100+ parts

$8.728

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$8.268

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1,928

$9.187

$8.728

$8.268

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AZTECH Wire

Italy . 405 parts In-Stock

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$11.974

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405

$11.974

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One Stop Electronics

USA . 237 parts In-Stock

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$22.000

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237

$22.000

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DigiPath Technology Company

USA . 1,364 parts In-Stock

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$8.283

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1,364

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$8.283

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Corphita

USA . 848 parts In-Stock

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Overview

Unlock the power of precision with the SNJ54LS685FK from Texas Instruments, a cutting-edge digital arithmetic circuit designed to revolutionize your electronics projects. Manufactured with unparalleled quality and expertise by Texas Instruments, this chip carrier boasts a myriad of applications in various industries. From aerospace to telecommunications, this versatile component offers customers unmatched value, benefits, and advantages. Experience seamless integration, reliable performance, and superior results with the SNJ54LS685FK - the perfect choice for all your digital arithmetic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures durability and reliability, making this product suitable for rugged environments.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with a wide range of systems and power sources.

Propagation Delay (tpd): 35 ns

With a low propagation delay of 35 ns, this product offers fast signal processing and helps in reducing latency in digital arithmetic operations.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy interfacing with other components or devices, providing flexibility and versatility in circuit design.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic levels, making it easy to integrate into existing TTL-based systems.

Temperature Grade: MILITARY

Designed for military-grade applications, this product meets stringent temperature and reliability requirements, making it suitable for mission-critical operations.

Technical Specifications

Digital Arithmetic Circuits SNJ54LS685FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH A = B & A > B OUTPUTS

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SNJ54LS685FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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