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SNC54S181W

Texas Instruments

SNC54S181W by Texas Instruments

Texas Instruments' SNC54S181W is a TTL digital arithmetic circuit with 24 terminals in a ceramic flatpack package. Operating temperature ranges from -55°C to 125°C, suitable for military applications requiring MIL-STD-883 Class B screening. It features surface mount capability and dual terminal position for robust performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,322 parts In-Stock

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7,322

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Digiode

USA . 4,042 parts In-Stock

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4,042

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Electronic Expediters

USA . 62 parts In-Stock

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62

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Distributors (Availability)

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Andel Nordic

Denmark . 410 parts In-Stock

1+ parts

$6.587

100+ parts

-

1k+ parts

$6.323

10k+ parts

$6.323

410

$6.587

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$6.323

$6.323

AZTECH Wire

Italy . 607 parts In-Stock

1+ parts

$8.065

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607

$8.065

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Parana Technologies

USA . 2,141 parts In-Stock

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$26.364

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$26.958

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2,141

$26.364

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$26.958

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ChromeModa Solutions

Germany . 4,057 parts In-Stock

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$29.622

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$24.290

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4,057

$29.622

$24.290

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IDEA Electronic Components Group

UK . 1,375 parts In-Stock

1+ parts

$29.622

100+ parts

$28.141

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$26.660

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1,375

$29.622

$28.141

$26.660

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One Stop Electronics

USA . 802 parts In-Stock

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$65.000

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802

$65.000

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Corphita

USA . 3,883 parts In-Stock

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3,883

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DigiPath Technology Company

USA . 859 parts In-Stock

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$26.707

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859

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$26.707

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Overview

Unlock the power of digital arithmetic circuits with the Texas Instruments SNC54S181W. Manufactured with top-quality materials and stringent screening levels, this product guarantees reliability and durability. Ideal for military-grade applications, this flatpack style circuit offers precision and efficiency in a compact design. Experience seamless operation in extreme temperatures ranging from -55 to 125°C. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs for accurate and high-performance digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and mechanical stability, making them suitable for high-temperature applications.

Surface Mount: YES

Surface mount technology allows for efficient assembly processes and reduces the overall size of the product, making it ideal for compact designs.

Screening Level: MIL-STD-883 Class B (Modified)

This screening level ensures high reliability and performance standards, making the product suitable for rugged environments or critical applications.

Package Shape: RECTANGULAR

Rectangular packages are easier to handle and offer more space for pin configurations, improving the overall usability of the product.

No. of Terminals: 24

The higher number of terminals allows for more complex arithmetic operations or connections, increasing the versatility of the product.

Package Style (Meter): FLATPACK

Flatpack style packages offer a low profile and efficient heat dissipation, making them suitable for high-density circuit designs or applications with limited space.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance under extreme conditions, making the product suitable for harsh environments or industrial applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the product to function in cold environments or during temperature fluctuations without degradation in performance.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable connections, improving the overall durability and longevity of the product.

Temperature Grade: MILITARY

Military-grade temperature rating ensures the product's reliability and performance in extreme conditions, making it suitable for aerospace, defense, or mission-critical applications.

Technology: TTL

TTL technology offers high-speed operation and low power consumption, making the product suitable for applications requiring fast arithmetic calculations or data processing.

Terminal Form: FLAT

Flat terminal forms provide stable connections and easy soldering, ensuring reliable electrical contact and ease of assembly during manufacturing processes.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density integration and precise connections, making the product suitable for compact circuit layouts or applications requiring miniaturization.

Technical Specifications

Digital Arithmetic Circuits SNC54S181W attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL24,.4

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNC54S181W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-500-0193, 5962005000193

NIIN

005000193

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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