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SNC54LS283W

Texas Instruments

SNC54LS283W by Texas Instruments

SNC54LS283W by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals and a supply voltage of 5V. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military applications. This rectangular flatpack package is surface mountable and meets MIL-STD-883 Class B standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,608 parts In-Stock

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Digiode

USA . 2,601 parts In-Stock

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2,601

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 598 parts In-Stock

1+ parts

$2.875

100+ parts

-

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$2.760

10k+ parts

$2.760

598

$2.875

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$2.760

$2.760

AZTECH Wire

Italy . 373 parts In-Stock

1+ parts

$14.182

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373

$14.182

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One Stop Electronics

USA . 714 parts In-Stock

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$24.000

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714

$24.000

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Parana Technologies

USA . 415 parts In-Stock

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$26.160

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$26.742

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415

$26.160

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$26.742

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DigiPath Technology Company

USA . 1,045 parts In-Stock

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$28.805

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1,045

$28.805

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ChromeModa Solutions

Germany . 2,348 parts In-Stock

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$29.393

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$24.102

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2,348

$29.393

$24.102

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IDEA Electronic Components Group

UK . 94 parts In-Stock

1+ parts

$29.393

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$27.923

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$26.454

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94

$29.393

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$26.454

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Corphita

USA . 4,201 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the SNC54LS283W from Texas Instruments. Crafted with precision and quality materials, this product offers reliable performance in a variety of applications. Designed for military-grade temperatures, this flatpack package houses advanced TTL technology, providing customers with a durable solution that ensures consistent operation. Experience the value and benefits of Texas Instruments' expertise in digital arithmetic circuits with the SNC54LS283W.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal properties, making it suitable for high temperature applications and improving reliability.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Screening Level: MIL-STD-883 Class B (Modified)

High screening level ensures reliability and performance under harsh environmental conditions, making it ideal for military or aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage of 5V ensures compatibility with common power sources and simplifies design requirements.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable operation in a wide range of environments without risk of overheating.

Technology: TTL

TTL technology offers fast switching speeds and high noise immunity, making the product suitable for applications requiring precise digital calculations.

Technical Specifications

Digital Arithmetic Circuits SNC54LS283W attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNC54LS283W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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