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SN74AS181AN3

Texas Instruments

SN74AS181AN3 by Texas Instruments

SN74AS181AN3 by Texas Instruments is a TTL digital arithmetic circuit with 24 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, suitable for commercial applications. With through-hole terminal form and 2.54mm pitch, it's ideal for various digital computing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,124 parts In-Stock

1+ parts

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5,124

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Digiode

USA . 2,842 parts In-Stock

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2,842

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 783 parts In-Stock

1+ parts

$5.045

100+ parts

-

1k+ parts

$4.843

10k+ parts

$4.843

783

$5.045

-

$4.843

$4.843

Parana Technologies

USA . 2,035 parts In-Stock

1+ parts

$7.737

100+ parts

-

1k+ parts

$8.271

10k+ parts

-

2,035

$7.737

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$8.271

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DigiPath Technology Company

USA . 1,522 parts In-Stock

1+ parts

$8.519

100+ parts

$7.838

1k+ parts

-

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1,522

$8.519

$7.838

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IDEA Electronic Components Group

UK . 1,295 parts In-Stock

1+ parts

$8.693

100+ parts

$8.258

1k+ parts

$7.824

10k+ parts

-

1,295

$8.693

$8.258

$7.824

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ChromeModa Solutions

Germany . 138 parts In-Stock

1+ parts

$8.693

100+ parts

$7.128

1k+ parts

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138

$8.693

$7.128

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AZTECH Wire

Italy . 848 parts In-Stock

1+ parts

$10.475

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848

$10.475

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One Stop Electronics

USA . 1,222 parts In-Stock

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$17.000

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1,222

$17.000

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Corphita

USA . 2,598 parts In-Stock

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2,598

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Overview

Upgrade your digital arithmetic circuits with the SN74AS181AN3 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable and efficient solutions for a wide range of applications. With its durable package body material and advanced technology, this product ensures optimal performance even in demanding environments. Experience seamless operation and increased productivity with the SN74AS181AN3, a valuable investment that provides countless benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight material that is durable and cost-effective for mass production.

Package Shape: RECTANGULAR

Sleek design that allows for easy integration into various systems.

No. of Terminals: 24

Provides ample connectivity options for various input/output signals.

Package Style (Meter): IN-LINE

Compact design that saves space and simplifies installation.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments effectively.

Terminal Position: DUAL

Increases flexibility in wiring configurations and reduces signal interference.

Temperature Grade: COMMERCIAL

Meets industry standards for commercial-grade applications.

Technology: TTL

Utilizes Transistor-Transistor Logic for high-speed and reliable digital signal processing.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and secure connection to circuit boards.

Terminal Pitch: 2.54 mm

Standardized pitch size for compatibility with various electronic components.

Technical Specifications

Digital Arithmetic Circuits SN74AS181AN3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS181AN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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