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SN74S181N

Texas Instruments

SN74S181N by Texas Instruments

SN74S181N by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 30 ns. Operating at a supply voltage range of 4.75V to 5.25V, it has a max power supply current of 220mA and is ideal for commercial temperature grade applications requiring true output polarity in TTL technology.

Median Price

$1.663

Lifecycle Status

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36

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1k+

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Rochester

USA . 6,096 parts In-Stock

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$1.600

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DigiKey

USA . 6,096 parts In-Stock

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Verical

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$1.475

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Digiode

USA . 1,867 parts In-Stock

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Vyrian

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TEDSS.com

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Ace Electronics

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DF Sales Co.

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American Microsemiconductor Inc.

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DigiKey Marketplace

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MISTER SPROCKETS

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Electronic Expediters

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ComSIT Distribution GmbH

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Manoshevitz Elec. Sales

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Fibra_Brandt Electronic GMBH

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Halfin

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Sunrise Surplus Inc.

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Mil-Aero Solutions, Inc.

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Digital Electronic Gebert Verwaltungs UG

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Prism Electronics

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J & M Industries LLC

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Lakeland Logistics Inc

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Semicontronic

India . 5,929 parts In-Stock

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$1.110

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$1.082

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Corphita

USA . 4,461 parts In-Stock

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Component Stockers USA

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Andel Nordic

Denmark . 349 parts In-Stock

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$5.325

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Parana Technologies

USA . 1,262 parts In-Stock

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$11.586

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DigiPath Technology Company

USA . 975 parts In-Stock

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ChromeModa Solutions

Germany . 5,616 parts In-Stock

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IDEA Electronic Components Group

UK . 913 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,415 parts In-Stock

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Schahn Electronic Components

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Perfect Parts

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Overview

Upgrade your digital arithmetic circuits with the SN74S181N from Texas Instruments. Manufactured with precision and expertise, this high-quality product offers unparalleled performance and reliability. Perfect for a wide range of applications, this versatile component provides seamless integration and enhanced functionality. Trust in Texas Instruments to deliver cutting-edge solutions that bring value and benefits to your projects. Choose the SN74S181N for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the electronic components inside, ensuring a longer lifespan for the product.

No. of Bits: 4

Offers sufficient precision and accuracy for digital arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Works well within standard voltage levels, making it compatible with a wide range of applications.

Propagation Delay (tpd): 30 ns

Provides fast response times for processing arithmetic operations efficiently.

Technology: TTL

Uses Transistor-Transistor Logic technology, known for its reliability and compatibility with various digital systems.

Technical Specifications

Digital Arithmetic Circuits SN74S181N attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

S

JESD-30 Code:

R-PDIP-T24

Length:

31.75 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

220 mA

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

SN74S181N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-632-8283, 5962006328283, 5962-01-096-2190, 5962010962190

NIIN

006328283, 010962190

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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