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SN74S281DWR

Texas Instruments

SN74S281DWR by Texas Instruments

SN74S281DWR by Texas Instruments is a 4-bit digital arithmetic circuit with a nominal voltage of 5V and propagation delay of 45ns. This small outline package has 24 terminals, operates in commercial temperature grade, and is ideal for applications requiring fast arithmetic calculations in TTL technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,228 parts In-Stock

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8,228

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Digiode

USA . 921 parts In-Stock

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921

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Distributors (Availability)

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Andel Nordic

Denmark . 2,734 parts In-Stock

1+ parts

$6.509

100+ parts

-

1k+ parts

$6.249

10k+ parts

$6.249

2,734

$6.509

-

$6.249

$6.249

Parana Technologies

USA . 1,534 parts In-Stock

1+ parts

$7.999

100+ parts

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$8.578

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1,534

$7.999

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$8.578

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DigiPath Technology Company

USA . 184 parts In-Stock

1+ parts

$8.808

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184

$8.808

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ChromeModa Solutions

Germany . 4,292 parts In-Stock

1+ parts

$8.988

100+ parts

$7.370

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4,292

$8.988

$7.370

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IDEA Electronic Components Group

UK . 1,206 parts In-Stock

1+ parts

$8.988

100+ parts

$8.539

1k+ parts

$8.089

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1,206

$8.988

$8.539

$8.089

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AZTECH Wire

Italy . 476 parts In-Stock

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$13.497

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476

$13.497

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One Stop Electronics

USA . 1,040 parts In-Stock

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$47.000

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1,040

$47.000

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Corphita

USA . 1,354 parts In-Stock

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1,354

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Overview

Upgrade your digital arithmetic circuits with the SN74S281DWR by Texas Instruments. Crafted with precision and quality, this product offers unmatched reliability and performance in a compact rectangular package. Ideal for a wide range of applications, this 4-bit circuit is designed to operate at a nominal supply voltage of 5V, ensuring seamless integration into your projects. Experience faster propagation delays, lower power consumption, and exceptional temperature tolerance with this versatile component. Invest in Texas Instruments for superior technology that delivers value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its excellent insulation properties and durability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

No. of Bits: 4

This indicates the number of bits the circuit can process, making it suitable for simple arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage level allows for compatibility with a wide range of systems and power sources.

Load Capacitance (CL): 15 pF

Having a low load capacitance helps in reducing signal delay and improving overall performance.

No. of Terminals: 24

Having a sufficient number of terminals allows for easy connectivity and integration into circuits.

Propagation Delay (tpd): 45 ns

The low propagation delay ensures fast processing speed, making the circuit suitable for real-time applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this circuit can withstand a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The circuit can operate in cold temperatures without any performance issues, making it versatile for various applications.

Terminal Position: DUAL

The dual terminal position allows for flexibility in installation and ensures reliable connections.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making it energy-efficient and suitable for digital applications.

Maximum Power Supply Current (ICC): 230 mA

With a high maximum power supply current, the circuit can handle heavy loads without overheating or malfunctioning.

Technical Specifications

Digital Arithmetic Circuits SN74S281DWR attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD; CAPABLE OF 15 LOGIC & ARITHMETIC OPERATIONS

Family:

S

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

230 mA

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN74S281DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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