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SNJ54LS382AFK

Texas Instruments

SNJ54LS382AFK by Texas Instruments

SNJ54LS382AFK by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 39ns. It operates at a supply voltage range of 4.5V to 5.5V and has a temperature grade of MILITARY, making it suitable for military-grade applications requiring fast arithmetic calculations in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,877 parts In-Stock

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Vyrian

USA . 3,967 parts In-Stock

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3,967

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Distributors (Availability)

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Andel Nordic

Denmark . 712 parts In-Stock

1+ parts

$2.483

100+ parts

-

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$2.384

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$2.384

712

$2.483

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$2.384

$2.384

Parana Technologies

USA . 1,612 parts In-Stock

1+ parts

$16.462

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$16.755

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1,612

$16.462

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$16.755

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AZTECH Wire

Italy . 562 parts In-Stock

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$16.539

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562

$16.539

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DigiPath Technology Company

USA . 732 parts In-Stock

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$18.127

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732

$18.127

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ChromeModa Solutions

Germany . 4,483 parts In-Stock

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$18.497

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$15.168

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$18.497

$15.168

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IDEA Electronic Components Group

UK . 1,506 parts In-Stock

1+ parts

$18.497

100+ parts

$17.572

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$16.647

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1,506

$18.497

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$16.647

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One Stop Electronics

USA . 340 parts In-Stock

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$29.000

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Corphita

USA . 1,502 parts In-Stock

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Overview

Experience unmatched quality and reliability with the SNJ54LS382AFK by Texas Instruments, a leading manufacturer in digital arithmetic circuits. This versatile chip carrier offers exceptional performance in various applications, providing customers with fast propagation delay of 39ns and a wide temperature range from -55 to 125°C. With its military-grade technology and no-lead terminal form, this square-shaped package ensures seamless integration and superior functionality. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations and add value to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent durability and reliability, making the product suitable for harsh environments.

No. of Bits: 4

Offers a good balance between complexity and efficiency for arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Suitable voltage level for optimal performance and compatibility with standard power sources.

Propagation Delay (tpd): 39 ns

Fast processing speed ensures quick arithmetic calculations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of operating conditions.

Technology: TTL

TTL technology offers reliable and high-speed performance for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits SNJ54LS382AFK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

39 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54LS382AFK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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