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SN74LS275NP3

Texas Instruments

SN74LS275NP3 by Texas Instruments

SN74LS275NP3 by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. The through-hole terminal form and 2.54mm pitch enhance its usability in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,608 parts In-Stock

1+ parts

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8,608

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Digiode

USA . 4,081 parts In-Stock

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1k+ parts

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4,081

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,200 parts In-Stock

1+ parts

$8.169

100+ parts

-

1k+ parts

$7.842

10k+ parts

$7.842

1,200

$8.169

-

$7.842

$7.842

Parana Technologies

USA . 1,688 parts In-Stock

1+ parts

$15.547

100+ parts

$1,443.730

1k+ parts

$13.992

10k+ parts

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1,688

$15.547

$1,443.730

$13.992

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DigiPath Technology Company

USA . 632 parts In-Stock

1+ parts

$17.119

100+ parts

$15.749

1k+ parts

-

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632

$17.119

$15.749

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ChromeModa Solutions

Germany . 6,680 parts In-Stock

1+ parts

$17.468

100+ parts

$14.324

1k+ parts

-

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6,680

$17.468

$14.324

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IDEA Electronic Components Group

UK . 270 parts In-Stock

1+ parts

$17.468

100+ parts

$16.595

1k+ parts

$15.721

10k+ parts

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270

$17.468

$16.595

$15.721

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AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$18.000

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784

$18.000

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One Stop Electronics

USA . 189 parts In-Stock

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$52.000

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189

$52.000

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Corphita

USA . 1,328 parts In-Stock

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1,328

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Overview

Elevate your digital arithmetic circuits with the SN74LS275NP3 from Texas Instruments. Known for their superior quality and reliable performance, Texas Instruments has designed this product to meet the demands of various applications in the digital realm. With its durable plastic/epoxy package body and 16 terminals in an in-line rectangular shape, this component ensures seamless integration and maximum efficiency. Experience the value and benefits of this high-grade technology, offering customers unmatched reliability and precision in their circuit designs. Upgrade your projects with the SN74LS275NP3 and unlock a world of possibilities in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures that the product is durable and resistant to physical damage, making it a reliable choice for long-term use.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit designs and ensures efficient use of space on circuit boards.

No. of Terminals: 16

With 16 terminals, this product offers sufficient connectivity options for various applications, making it versatile and adaptable to different circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style makes it convenient to connect the product in a linear manner, simplifying the overall circuit design and layout.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures that the product can withstand elevated temperatures without compromising its performance, making it suitable for demanding applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the product remains functional even in cold environments, providing reliability in a wide range of operating conditions.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connection of external components, ensuring stable electrical connections and reducing the likelihood of signal interference.

Temperature Grade: COMMERCIAL

The commercial temperature grade signifies that the product is suitable for standard commercial applications where temperature variations are within specified limits, ensuring reliable performance in typical operating environments.

Technology: TTL

The use of TTL (Transistor-Transistor Logic) technology ensures fast switching speeds and low power consumption, making the product efficient and ideal for high-speed digital arithmetic operations.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a robust connection between the product and the circuit board, offering mechanical stability and ease of soldering during installation.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for convenient spacing between terminals, facilitating easy wiring and circuit assembly, making the product user-friendly and suitable for DIY projects.

Technical Specifications

Digital Arithmetic Circuits SN74LS275NP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS275NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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